Underfill Void Measurement via Welding Angle Simulation
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Solution Overview
Problem
Voids in the underfill material of flip-chip packages due to non-uniform flow patterns affect the electrical and mechanical characteristics and lifespan of the package, making it challenging to determine if the package meets requirements without accurate measurement and correction.
Innovation Solution
A method involving obtaining a welding angle profile, simulating void profiles, determining high-risk void regions, and performing a pressure-curing procedure at selected pressures and temperatures to reduce void dimensions, with iterative adjustments as necessary, to meet void requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If underfill material is injected to fill the cavity, then the cavity is filled and package structure is formed, but voids are generated due to non-uniform flow pattern
Solution Approach 1:
The patent applies preliminary action by simulating the underfill flow process before actual manufacturing to identify potential void formation areas. The welding angle profile is obtained and simulated void profiles are generated in advance to predict high-risk void regions, allowing process parameters to be optimized before actual underfill injection, thereby preventing void formation while ensuring complete cavity filling.
2Manufacturing precision
If pressure-curing procedure is performed to reduce void dimensions, then void size is reduced and meets requirements, but process time and complexity increase
Solution Approach 1:
The patent uses preliminary simulation to predict void formation and identify high-risk regions before actual manufacturing. By obtaining welding angle profiles and generating simulated void profiles in advance, the process can target specific high-risk regions for pressure-curing treatment rather than treating the entire package, reducing the time and complexity of void mitigation while ensuring void dimensions meet requirements.
3Measurement precision
If simulation and measurement procedures are performed to detect voids, then void positions and dimensions are identified, but measurement complexity and detection difficulty increase
Solution Approach 1:
The patent applies the copying principle by creating simulated void profiles that replicate the expected void distribution based on welding angle measurements. Instead of directly measuring complex three-dimensional void structures, the method generates two-dimensional simulated profiles that copy the essential void characteristics, making detection and measurement simpler while maintaining high precision in identifying void positions and dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively measures and mitigates voids in underfill packages, ensuring they meet specifications, thereby improving the electrical and mechanical characteristics and lifespan of the flip-chip underfill package.
Implementation Method 1
due to a non-uniform flow pattern of an underfill material, voids may exist in the underfill material
Implementation Method 2
simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region
Implementation Method 3
simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region
Data Source
AI summary
The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.