Underfloor Coolant Piping Modules for Rack Cooling Access

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Solution Overview

Problem

Existing data center cooling systems require overhead or raised floor installations, which are cumbersome and often impractical, especially when raised floors cannot be installed, and existing cooling-distribution units (CDUs) occupy valuable whitespace.

Innovation Solution

An underfloor fluid distribution system using piping-container modules that receive liquid-cooling piping from a CDU and equipment racks, with integrated seals, leak detection, and walking platforms, allowing coolant transfer beneath equipment racks without the need for overhead or raised floors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If overhead cooling system is used, then liquid-cooling can be provided to IT equipment, but the system becomes cumbersome and requires overhead installation space

Engineering Contradiction:
Improvecooling installation easeVSAvoidcooling system complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent inverts the traditional overhead cooling approach by implementing underfloor cooling distribution. Instead of mounting headers and piping overhead, the system places fluid distribution infrastructure beneath the raised floor, allowing coolant to be delivered to equipment racks from below through vertical connections at rack locations.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions the cooling distribution system from a vertical overhead arrangement to a horizontal underfloor arrangement. The fluid distribution occurs in the plenum space beneath the raised floor, representing a dimensional shift from overhead three-dimensional space to the horizontal plane of the floor assembly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If raised floor is used for cooling, then liquid-cooling can be transferred beneath equipment rack, but the entire data center floor must be raised or a partial basement created

Engineering Contradiction:
Improvecoolant transfer capabilityVSAvoidfloor infrastructure requirements
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent segments the cooling distribution function from the overall floor infrastructure. Instead of requiring a fully raised floor or basement construction, the system uses localized underfloor plenum spaces with targeted fluid distribution at specific rack locations, separating the cooling function from comprehensive floor reconstruction.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The raised floor serves multiple functions: it provides structural support for equipment racks, creates an underfloor plenum for fluid distribution, and maintains accessibility for cable management and maintenance activities. The floor assembly becomes a multi-functional platform integrating mechanical, electrical, and cooling infrastructure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If traditional rack or skid CDUs are used, then cooling distribution can be provided, but valuable whitespace is occupied

Engineering Contradiction:
Improvecooling distribution capabilityVSAvoidwhitespace occupancy
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The patent relocates the CDU from the horizontal plane (rack or skid form factors occupying floor whitespace) to the vertical underfloor plenum space. This dimensional relocation allows the cooling distribution unit to operate from beneath the raised floor, freeing up valuable floor space for equipment placement and data center operations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20260052646A1Underfloor fluid distribution system
Publication Date: 2026.02.19 SCHNEIDER ELECTRIC IT CORP
  • US20260052646A1 patent drawing
  • US20260052646A1 patent drawing
  • US20260052646A1 patent drawing

AI summary

A piping-container module includes a module body, a first portion formed in the module body, and a second portion formed in the module body. The first portion is configured to receive first liquid-cooling piping coupled to a cooling-distribution unit. The second portion is configured to receive second liquid-cooling piping coupled to an equipment rack. The piping-container module further includes a seal coupled to the first portion and the second portion and a walking platform configured to be coupled to the module body. The walking platform is configured to enable a person to walk on the piping-container module.