Underlayer Film Composition for Imprinting Wettability

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

There is a need to improve the wettability of curable compositions for imprinting with respect to underlayer films and enhance the adhesiveness between the underlayer film and the cured product in semiconductor device manufacturing, as existing methods face challenges in achieving optimal surface interaction and pattern formation.

Innovation Solution

A kit comprising a curable composition for imprinting and a composition for forming an underlayer film, where the underlayer film composition includes a polymer with a polymerizable functional group and a compound with a boiling point and thermal decomposition temperature of 480°C or higher, and a Hansen solubility parameter distance from the curable composition's highest content component of 2.5 or less, ensuring improved affinity and adhesiveness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional underlayer film composition is used, then the manufacturing process is simple, but the wettability of curable composition and adhesiveness to cured product are insufficient

Engineering Contradiction:

Improvewettability and adhesivenessVSAvoidcomposition formulation complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention changes the chemical composition parameters of the underlayer film by incorporating specific compounds with hydroxyl groups (e.g., polyhydric alcohols, sugar alcohols) and controlling their molecular weight and content ratios. These parameter changes improve the wettability and adhesiveness without significantly complicating the manufacturing process

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite underlayer film composition by combining multiple components: compounds with hydroxyl groups (polyhydric alcohols, sugar alcohols), polymers, and optional solvents. This composite approach synergistically improves both wettability and adhesiveness while maintaining processability

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If the underlayer film composition is optimized for wettability, then the pattern formation quality improves, but the manufacturing complexity increases

Engineering Contradiction:

Improvepattern formation qualityVSAvoidcomposition preparation difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention optimizes specific parameters including the molecular weight range of polyhydric alcohols (100-1000), the content ratio of sugar alcohols (1-50 parts by mass per 100 parts polyhydric alcohol), and the total content of hydroxyl-containing compounds (1-50 parts by mass per 100 parts polymer). These controlled parameter changes achieve high pattern formation quality while keeping the manufacturing process manageable

Inventive Principle:

Principle #35Parameter changes

3Strength

If a simple underlayer film composition is used, then the manufacturing process is easy, but the adhesiveness between underlayer film and cured product deteriorates

Engineering Contradiction:

ImproveadhesivenessVSAvoidcomposition formulation

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The invention introduces compounds with hydroxyl groups as key adhesive promoters, controlling their molecular weight (100-1000 for polyhydric alcohols) and content ratios (1-50 parts sugar alcohol per 100 parts polyhydric alcohol). These parameter changes significantly enhance adhesiveness while maintaining formulation simplicity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The hydroxyl-containing compounds act as intermediary substances between the underlayer film and the cured product, forming chemical or physical bonds that strengthen the interface. These compounds mediate the interaction between the polymer matrix and the curing agents, improving overall adhesiveness

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the wettability of the curable composition on the underlayer film and improves the adhesiveness between the underlayer film and the cured product, leading to better pattern formation and manufacturing efficiency in semiconductor devices.

Implementation Method 1

a polymer having a polymerizable functional group

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

ΔHSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less

Methodology Applied

Scientific EffectHansen solubility parameter:

Implementation Method 3

a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher

Methodology Applied

Scientific EffectThermal stability:

Data Source

PatentUS11710641B2Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor device

Publication Date: 2023.07.25 FUJIFILM CORP

AI summary

Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher and ΔHSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.