Underlayer Resin Composition for Imprint Adhesion and Flatness
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Solution Overview
Problem
The adhesiveness between the substrate and the photocurable composition for imprints is insufficient, leading to separation issues during the mold separation process in imprint technology, despite previous resin compositions improving surface flatness and adhesiveness.
Innovation Solution
A resin composition for underlayer film formation is developed, incorporating specific groups represented by General Formulae (A) and (B), along with a solvent, which enhances adhesiveness to both the imprint layer and the base material, while maintaining excellent surface flatness, by using a protected carboxyl group that deprotects to improve adhesion and a solvent like propylene glycol monomethyl ether acetate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional resin composition is used to improve surface flatness, then surface flatness is improved, but adhesiveness between the substrate and photocurable composition remains insufficient
Solution Approach 1:
The patent uses a composite resin composition containing both a polar group-bearing resin (for adhesiveness) and a non-polar resin (for surface flatness). This combination allows the underlayer to simultaneously achieve good adhesion to the substrate and excellent surface flatness, resolving the contradiction between these two properties.
Solution Approach 2:
The patent applies different resin components with different properties to different aspects of the underlayer function: the polar group-bearing resin provides adhesiveness at the substrate interface, while the non-polar resin provides surface flatness at the top surface. This local differentiation of material properties resolves the contradiction.
2Ease of manufacture
If the photocurable composition is applied directly to the substrate, then the process is simple, but separation occurs during mold separation due to insufficient adhesiveness
Solution Approach 1:
The patent introduces an underlayer composed of a specific resin composition as an intermediary between the substrate and the photocurable composition. This underlayer mediates the interaction by providing both adhesion to the substrate and a flat surface for the photocurable composition, preventing separation during mold removal while adding only a simple additional coating step.
3Reliability
If a resin with high adhesiveness is used, then adhesiveness is improved, but surface flatness deteriorates
Solution Approach 1:
The patent employs a composite resin system where a polar group-bearing resin (providing adhesiveness) is combined with a non-polar resin (providing surface flatness). The polar resin ensures good adhesion to the substrate, while the non-polar resin component maintains excellent surface flatness, thus resolving the contradiction between these two properties.
Solution Approach 2:
The patent assigns different functional properties to different components within the resin composition: the polar group-bearing resin operates at the substrate interface to provide adhesiveness, while the non-polar resin operates at the surface level to provide flatness. This functional differentiation resolves the contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves improved adhesiveness and surface flatness, reducing separation failures during mold separation and enabling effective pattern formation in imprint technology.
Implementation Method 1
a resin composition for underlayer film formation which is used for improving adhesiveness between a photocurable composition for imprints and a base material
Implementation Method 2
using a protected carboxyl group that deprotects to improve adhesion
Implementation Method 3
imprint method using a curable composition (for example, see M. Colburn et al: Proc. SPIE, Vol. 3676, 379 (1999))
Data Source
AI summary
A resin composition for underlayer film formation capable of forming an underlayer film having good adhesiveness and excellent surface flatness, a layered product, a method for forming a pattern and a process for producing a device are provided. The resin composition for underlayer film formation includes a resin having a group represented by General Formula (A) and a group represented by General Formula (B), and a solvent. Ra1 represents a hydrogen atom or a methyl group, Rb1 and Rb2 each independently represents an unsubstituted linear or branched alkyl group having 1 to 20 carbon atoms or an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, Rb3 represents an unsubstituted linear or branched alkyl group having 2 to 20 carbon atoms or an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and Rb2 and Rb3 may be bonded to each other to form a ring.