Underlayer Resin Composition for Imprint Uniformity
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Solution Overview
Problem
In imprint technology, there is a challenge with adhesiveness between the substrate and the photocurable composition, leading to variations in line width distribution due to large variations in the thickness distribution of residual film layers after mold pressing.
Innovation Solution
A resin composition for underlayer film formation is developed, incorporating a nonionic surfactant, a resin with specific functional groups, and a solvent, which improves adhesiveness and reduces surface tension, resulting in a more uniform residual film layer and reduced line width distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resin compositions are used for underlayer film formation, then the film can be formed on the substrate, but large variations in thickness distribution occur leading to line width variations after etching
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating specific functional groups (oxiranyl groups at 0.01-5 mass% and oxetanyl groups at 0.01-5 mass%) into the resin structure. This chemical parameter modification improves the adhesiveness between the underlayer film and substrate, thereby reducing thickness distribution variations and achieving more uniform line widths after etching.
Solution Approach 2:
The patent creates a composite resin system by combining multiple resin components with specific functional groups. The resin composition includes polymers containing oxiranyl and/or oxetanyl groups in controlled amounts, forming a composite material that exhibits improved interfacial adhesiveness and more uniform film thickness distribution compared to conventional single-component resins.
2Ease of operation
If the adhesiveness between substrate and photocurable composition is insufficient, then the imprinting process can proceed, but large variations in residual film thickness occur
Solution Approach 1:
The patent modifies the resin composition parameters by incorporating oxiranyl and oxetanyl functional groups at controlled concentrations (0.01-5 mass% each). This parameter change enhances the chemical adhesion between the underlayer film and substrate, ensuring uniform residual film thickness while maintaining proper imprinting processability.
Solution Approach 2:
The oxiranyl and oxetanyl functional groups act as intermediary chemical structures that mediate the interaction between the substrate and the photocurable composition. These functional groups provide specific chemical bonding capabilities that improve interfacial adhesiveness, thereby ensuring uniform film formation without compromising the imprinting process.
3Ease of manufacture
If conventional resin compositions are used, then the underlayer film can be formed, but line width distribution varies after etching
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating oxiranyl and oxetanyl functional groups at controlled concentrations. This parameter modification improves the overall film quality and adhesiveness, which directly translates to more uniform line width distribution after etching while maintaining ease of underlayer film formation.
Solution Approach 2:
The patent employs a composite resin system containing multiple polymer components with specific functional groups. This composite material approach creates an underlayer film with improved structural uniformity and interfacial properties, resulting in consistent line width distribution after etching while preserving manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a small variation in residual film layer thickness, enhancing the uniformity of the imprint process and improving the releasability between the mold and the imprint layer, thereby minimizing line width distribution variations after processing.
Implementation Method 1
incorporating a nonionic surfactant, specific resin groups such as oxiranyl and oxetanyl, and a solvent like propylene glycol monomethyl ether acetate, which improves adhesiveness and reduces surface tension
Implementation Method 2
a resin having a group represented by General Formula (A) and at least one group selected from a group represented by General Formula (B1), an oxiranyl group and an oxetanyl group
Data Source
AI summary
Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device.A resin composition for underlayer film formation includes a resin having a group represented by General Formula (A) and at least one group selected from a group represented by General Formula (B), an oxiranyl group and an oxetanyl group, a nonionic surfactant and a solvent. Ra1 represents a hydrogen atom or a methyl group, Rb1 and Rb2 each independently represent a group selected from an unsubstituted linear or branched alkyl group having 1 to 20 carbon atoms and an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, Rb3 represents a group selected from an unsubstituted linear or branched alkyl group having 2 to 20 carbon atoms and an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and Rb2 and Rb3 may be bonded to each other to form a ring.


