Undulating Heatsink Channels for CCA Thermal Management
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Solution Overview
Problem
Traditional heat transfer methods in modular circuit card assemblies (CCAs) are inadequate for efficient thermal management due to limited surface area for heat dissipation, as they provide very little resultant surface area once tightened in place, which is insufficient for the growing power dissipation demands.
Innovation Solution
An electronic module assembly with a heatsink featuring an undulating channel feature along its lateral edge, aligned with the insertion axis of a connector, which engages with a rail feature on the chassis for enhanced thermal contact and heat dissipation, along with a wedge lock mechanism for secure retention and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional wedge locks are used for CCA retention, then the CCA can be securely retained in the chassis, but the contact surface area for heat transfer is very limited
Solution Approach 1:
The heatsink extends in the z-direction (perpendicular to the CCA plane) to create additional heat transfer surface area through its lateral edges, transforming a 2D contact problem into a 3D thermal management solution. The lateral edges of the heatsink provide vertical surfaces for thermal contact with the chassis, effectively increasing the heat transfer area without compromising retention strength.
2Temperature
If more heat sink material is added to increase surface area, then heat dissipation improves, but device complexity and cost increase
Solution Approach 1:
The heatsink is designed to utilize its lateral edges as separate heat transfer pathways, segmenting the thermal management function into distinct contact zones. This segmentation allows efficient heat dissipation through the side surfaces without requiring a bulky or complex overall heatsink structure, thereby improving heat dissipation while controlling device complexity.
3Ease of manufacture
If traditional retention methods are used, then assembly is simple, but thermal management performance is insufficient for high power dissipation
Solution Approach 1:
The heatsink structure serves multiple functions simultaneously: it provides mechanical support for the CCA, enables thermal contact with the chassis through its lateral edges, and acts as a heat dissipation component. This multi-functionality allows the same structural element to address both retention and thermal management requirements without complicating the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the contact surface area for improved thermal management, allows for self-alignment of CCAs, reduces the number of assembly steps and components, and lowers costs by minimizing the need for additional heat sink or fin material, while effectively dissipating heat from high-power components.
Implementation Method 1
Heat sink fins can be defined on an outside surface of the chassis in thermal communication with the rail feature for conducting heat away from the rail feature
Implementation Method 2
The wedge lock can be compressed against the wedge lock surface of the chassis
Data Source
AI summary
An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.