Uneven Adhesive Sheet for Precise Semiconductor Element Transfer

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Solution Overview

Problem

The challenge in microfabrication of semiconductor devices is the positional shift of elements during transfer due to the lack of precision in positioning accuracy when using conventional pressure sensitive adhesive sheets.

Innovation Solution

A pressure sensitive adhesive sheet with an uneven surface is employed to capture elements, featuring a base material and a pressure sensitive adhesive layer with specific molecular weights and storage moduli, and containing energy-reactive resins to maintain the uneven shape, facilitating precise element capture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional pressure sensitive adhesive sheet with a flat surface is used, then the transfer process is simple, but the positioning accuracy deteriorates causing element displacement

Engineering Contradiction:

Improvepositioning accuracyVSAvoidadhesive sheet structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The adhesive sheet surface is designed with unevenness (concave and convex portions) instead of a flat surface. The convex portions protrude from the surface while concave portions are recessed, creating a curved/uneven topography that enhances positioning accuracy by providing mechanical interlocking features that prevent element displacement during transfer.

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Measurement precision

If the adhesive sheet surface is made uneven to improve positioning accuracy, then element capture precision improves, but the manufacturing complexity increases

Engineering Contradiction:

Improvepositioning accuracyVSAvoidadhesive sheet fabrication

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The invention specifies precise parameter ranges for the uneven surface features: convex portion height (0.1-10 μm), concave portion depth (0.1-5 μm), and their relative dimensions. By controlling these geometric parameters within specific ranges, the adhesive sheet achieves improved positioning accuracy while maintaining manufacturability through standardized fabrication processes.

Inventive Principle:

Principle #35Parameter changes

3Strength

If pressure is increased to improve element capture, then adhesion strength improves, but positional deviation increases due to pressure-induced displacement

Engineering Contradiction:

Improveadhesion strengthVSAvoidpositioning accuracy

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The adhesive sheet features localized convex portions that concentrate adhesion force at specific contact points rather than distributing pressure uniformly across the entire element surface. This local quality approach allows sufficient adhesion strength at the convex contact points while minimizing overall pressure-induced displacement, thereby maintaining positioning accuracy.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250215276A1Adhesive sheet and method for manufacturing electronic component or semiconductor device

Publication Date: 2025.07.03 LINTEC CORP

AI summary

Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.