Uneven Heat Spreader Structure for Low-ESD Semiconductor Packaging
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Solution Overview
Problem
Semiconductor packages accumulate electric charges during manufacturing, leading to electrical stress and potential damage when these charges are discharged.
Innovation Solution
The semiconductor package incorporates a heat dissipation member with a surface featuring a plurality of uneven structures, which reduces the accumulation of electric charges by increasing the distance between the package and external metals, thereby decreasing capacitance and electrical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor package with a flat surface is used, then the manufacturing process is simple, but electric charges accumulate leading to electrical stress and potential damage
Solution Approach 1:
The patent applies dimensionality change by transitioning from a flat two-dimensional surface to a three-dimensional uneven surface with protruding structures. This dimensional transformation increases the distance between the heat dissipation member and external metals, thereby reducing capacitance and electrical stress while maintaining manufacturing feasibility through molding processes.
Solution Approach 2:
The heat dissipation member's surface is segmented into multiple protruding uneven structures rather than a continuous flat surface. This segmentation creates multiple isolated regions that collectively reduce the overall capacitance area, effectively lowering charge accumulation and electrical stress during manufacturing.
2Reliability
If the distance between the semiconductor package and external metals is increased to reduce capacitance, then electrical stress is reduced, but the package size increases
Solution Approach 1:
Instead of increasing the horizontal distance between the package and external metals, the patent utilizes the vertical dimension by creating protruding structures that extend upward. This approach reduces capacitance through increased vertical separation while maintaining a compact horizontal footprint, thus avoiding significant increases in overall package volume.
3Reliability
If uneven structures are added to the heat dissipation member, then charge accumulation is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the formation of uneven structures with the existing molding process of the heat dissipation member. By integrating the creation of protruding structures into the standard molding operation, the patent avoids adding separate manufacturing steps, thereby maintaining ease of manufacture while achieving the desired charge reduction effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the amount of electric charges accumulated in the semiconductor package, minimizing electrical stress and potential damage during the manufacturing process, while also reducing development costs and time.
Implementation Method 1
a magnitude of capacitance formed between the heat dissipation member and metal objects is influenced by the plurality of uneven structures
Data Source
AI summary
A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.