Uneven Thickness Heat Spreader for Compact Systems
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Solution Overview
Problem
Information handling systems face challenges in effectively dissipating heat, particularly in compact designs where passive cooling systems are limited by the size and shape of the internal space, leading to potential damage from accumulated heat.
Innovation Solution
An uneven thickness heat spreader is introduced, featuring varying thicknesses to conform to different physical structures within the system, coupled with active cooling systems to dissipate heat through convection, and optionally thermally linked to a battery for enhanced heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a uniform thickness heat spreader is used, then the manufacturing process is simple, but the thermal resistance is higher and heat dissipation efficiency is reduced
Solution Approach 1:
The heat spreader employs varying thickness across different regions, with thinner portions (0.5-1.5mm) in areas requiring lower thermal resistance and thicker portions (2-3mm) in areas requiring higher structural stability. This local variation optimizes heat dissipation efficiency while maintaining manufacturing feasibility through standard metal forming processes
Solution Approach 2:
The invention changes the thickness parameter of the heat spreader from a uniform value to a variable distribution, creating regions of different thickness to optimize the balance between thermal performance and structural requirements. This parameter variation allows tailored thermal management for different operational zones
2Reliability
If the heat spreader thickness is increased to reduce thermal resistance, then heat dissipation improves, but the device volume and weight increase
Solution Approach 1:
The heat spreader uses non-uniform thickness distribution, with thinner regions (0.5-1.5mm) where high heat dissipation is needed and thicker regions (2-3mm) where structural support is required. This localized optimization reduces overall material usage and device volume while maintaining effective heat transfer pathways
Solution Approach 2:
The invention transitions from a two-dimensional uniform thickness design to a three-dimensional variable thickness structure, allowing heat spreader optimization in the thickness dimension without increasing the planar footprint. This dimensional approach enables improved heat dissipation within compact volume constraints
3Volume of moving object
If the heat spreader thickness is decreased to reduce device volume, then the device becomes more compact, but thermal resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The heat spreader implements variable thickness with thinner portions (0.5-1.5mm) strategically placed in high heat flux areas to reduce thermal resistance, while thicker portions (2-3mm) provide structural support. This localized thickness optimization achieves compact volume without sacrificing heat dissipation efficiency
Solution Approach 2:
The invention varies the thickness parameter across the heat spreader surface, creating an optimized thickness distribution that reduces overall device volume while maintaining adequate heat transfer performance through regions of reduced thermal resistance
4Device complexity
If passive cooling systems are used in compact designs, then the system structure is simplified, but heat dissipation capability is insufficient due to space constraints
Solution Approach 1:
The heat spreader uses variable thickness to create optimized thermal pathways in space-constrained regions, with thinner areas (0.5-1.5mm) providing lower thermal resistance in compact zones. This local optimization enhances passive heat dissipation capability without increasing overall system complexity
Solution Approach 2:
The invention modifies the thickness parameter of the heat spreader to adapt to compact design constraints, creating a non-uniform structure that improves heat dissipation efficiency within limited space while maintaining a relatively simple passive cooling system architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uneven thickness heat spreader effectively distributes and dissipates heat across the information handling system, maintaining performance by reducing thermal resistance and increasing thermal conductivity, while accommodating the constraints of compact designs.
Implementation Method 1
An uneven thickness heat spreader is disclosed for an information handling system. The uneven thickness heat spreader may include a first portion with a first thickness and a second portion with a second thickness thicker than the first thickness
Implementation Method 2
coupled with active cooling systems to dissipate heat through convection
Data Source
AI summary
An information handling system includes a hardware processor, a memory device, a video display device, and a power management unit (PMU). The information handling system further includes an uneven thickness heat spreader cooling system including an uneven thickness heat spreader having a first thickness along a first portion of the uneven thickness heat spreader and a second thickness along a second portion of the uneven thickness heat spreader wherein the second thickness along a second portion of the uneven thickness heat spreader is formed at an information handling system chassis location where a width of the uneven thickness heat spreader is narrower than at the first portion of the uneven thickness heat spreader to transfer heat from a warmer portion of the information handling system chassis to a cooling portion of the information handling system chassis.