Uneven Wiring Bonding Surface for Semiconductor Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently dissipating heat and maintaining reliable electrical connections due to the uniform bonding surfaces of wiring members, which can lead to uneven heat distribution and potential failure points.
Innovation Solution
The semiconductor device incorporates a wiring member with a bonding surface that has an outer edge area and a middle area of different heights, featuring a rising portion from the outer periphery, enhancing heat dissipation and electrical connectivity through a non-uniform bonding structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a uniform bonding surface is used on the wiring member, then the manufacturing process is simple, but heat dissipation is inefficient and electrical connection reliability deteriorates
Solution Approach 1:
The bonding surface is divided into different regions with different heights: a first bonding surface at a first height and a second bonding surface at a second height. This local differentiation allows the first region to optimize for heat dissipation while the second region maintains electrical connection reliability, resolving the contradiction between heat dissipation efficiency and structural complexity.
2Reliability
If a uniform bonding surface is used on the wiring member, then the structure is simple, but solder thickness consistency and mechanical stability deteriorate
Solution Approach 1:
The bonding surface features a first bonding surface at a first height and a second bonding surface at a second height, creating distinct functional zones. The first bonding surface optimizes for electrical connection reliability with consistent solder thickness, while the second bonding surface provides mechanical stability. This local differentiation resolves the contradiction between reliability and structural complexity.
3Reliability
If a rising portion is added to the wiring member, then heat dissipation and electrical reliability improve, but manufacturing complexity increases
Solution Approach 1:
The wiring member incorporates a rising portion that changes the height parameter of the bonding surface, creating a first bonding surface at a first height and a second bonding surface at a second height. This parameter change optimizes both heat dissipation and electrical connection reliability while maintaining manufacturability through standard fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation and electrical reliability by ensuring consistent solder thickness and mechanical stability, reducing the risk of failure and enhancing overall device performance.
Implementation Method 1
bonded to the first electrode with a solder therebetween
Data Source
AI summary
A semiconductor device, including: a semiconductor chip having a first electrode and a second electrode respectively on a upper surface and a lower surface thereof; and a wiring member including a bonding portion having a bonding surface, which is bonded to the first electrode with a solder therebetween, and a rising portion extending from an outer periphery of the bonding portion, the bonding surface being located, in a plan view of the semiconductor device, within the upper surface of the semiconductor chip. The bonding surface has an outer edge area and a middle area. In a height direction of the semiconductor device, a first height from the outer edge area of the bonding surface to the upper surface of the semiconductor chip is greater than a second height from the middle area of the bonding surface to the upper surface of the semiconductor chip.