Unified Semiconductor Chips for Compact Stacked Packages
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Solution Overview
Problem
The challenge in semiconductor packaging is to reduce the occupied area while maintaining a compact vertical stack height, as existing technologies often require cutting and spacing semiconductor chips, which increases the horizontal area and complicates integration.
Innovation Solution
A semiconductor package design that unifies pairs of unit semiconductor chips at the wafer level, allowing them to be stacked without cutting, with vertically aligned boundary regions acting as scribe lanes, minimizing space and enhancing integration by maintaining horizontal continuity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If semiconductor chips are cut and spaced individually, then each chip can be separately mounted, but the horizontal area occupied increases
Solution Approach 1:
The patent merges multiple unit semiconductor chips into a unified wafer-level structure where chips are physically continuous without scribe lanes between them. This consolidation eliminates the horizontal space that would otherwise be occupied by spacing and cutting regions, directly resolving the contradiction between separate mounting capability and area occupation.
Solution Approach 2:
The invention transitions from horizontal arrangement of individual chips to vertical stacking of unified wafer-level structures. By moving the mounting approach to the vertical dimension, the patent achieves both separate device functionality and reduced horizontal footprint, as multiple chips share the same horizontal plane through vertical layering.
2Weight of moving object
If scribe lanes are introduced between chips, then chip separation is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the scribe lane element from the semiconductor chip structure. By removing these boundary regions entirely and replacing them with physically continuous chip regions, the invention simplifies the manufacturing process while maintaining chip separability through alternative means, directly addressing the contradiction between separability and manufacturing complexity.
3Ease of operation
If chips are arranged horizontally with spacing, then individual chip access is improved, but vertical stack height increases
Solution Approach 1:
The patent resolves this contradiction by reconfiguring the spatial arrangement from horizontal dispersion to vertical consolidation. Unified wafer-level structures are stacked vertically with aligned boundary regions, enabling chip access through vertical layering rather than horizontal spacing, thereby maintaining accessibility while minimizing vertical height occupation.
Data Source
AI summary
A semiconductor package includes one or more semiconductor stack structures mounted on a package board. The semiconductor stack structures include sequentially stacked first to fourth semiconductor devices. Each of the first to fourth semiconductor devices includes a first unit semiconductor chip and a second unit semiconductor chip. The first unit semiconductor chip and the second unit semiconductor chip are unitary. A method for fabricating the semiconductor package includes forming pairs of unit semiconductor chips on a wafer, forming a scribe lane between the pairs of unit semiconductor chips, separating the pairs of unit semiconductor chips into semiconductor devices, each of the semiconductor devices having a corresponding one pair of unit semiconductor chips.