Uniform Continuous Bi-Layer TMDC Films via Synchronous Growth

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Solution Overview

Problem

Current methods fail to produce large-area, uniform, and continuous bi-layer transition metal dichalcogenide (TMDC) films due to issues of thickness non-uniformity and lateral non-continuity, limiting their application in high-performance electronic devices.

Innovation Solution

Epitaxial growth of bi-layer TMDC films on a sapphire substrate with high surface steps, where top and bottom layers nucleate synchronously and align, using a vapor deposition technique to merge into large-area continuous films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If layer-by-layer mode is used to deposit bi-layer TMDC domains, then bi-layer TMDC domains can be obtained, but the domains are discontinuous and non-uniform

Engineering Contradiction:
Improveuniformity of bi-layer TMDCVSAvoidcontinuity of bi-layer TMDC film
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The substrate surface is pre-prepared with atomic steps before deposition. These steps serve as predetermined nucleation sites that guide the synchronous formation of top and bottom layers, ensuring they start growing in an aligned manner from the beginning rather than attempting to align later

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The deposition parameters are optimized to achieve synchronous growth of top and bottom layers. By controlling temperature, pressure, and deposition rate, the system maintains equal growth speeds for both layers, enabling them to remain aligned as they expand and eventually merge into continuous films

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If top layers are deposited on existing bottom layers, then bi-layer TMDC domains are formed, but edge alignment and thickness uniformity cannot be achieved

Engineering Contradiction:
Improveedge alignment of bi-layer TMDCVSAvoidcomplexity of deposition process
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Atomic steps are created on the substrate surface before deposition begins. These steps act as templates that simultaneously define the positions of both top and bottom layers, ensuring edge alignment is achieved automatically during synchronous growth without requiring complex post-deposition alignment procedures

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The atomic steps on the substrate self-organize the nucleation and growth of TMDC layers. The steps naturally guide the formation of aligned edges and uniform thickness through the synchronous growth mechanism, eliminating the need for external alignment controls or complex processing steps

Inventive Principle:
Principle #25Self-service

3Manufacturing precision

If synchronous growth is achieved, then uniform bi-layer films are obtained, but large-area continuity is difficult to achieve

Engineering Contradiction:
Improvethickness uniformity of bi-layer TMDCVSAvoidlateral dimension of bi-layer TMDC film
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The substrate is pre-patterned with atomic steps that extend across the entire substrate surface. These steps serve as continuous guidance structures that enable synchronous nucleation and growth of aligned bi-layer domains over large areas, allowing the domains to merge into continuous films while maintaining uniformity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Multiple aligned bi-layer domains that grow synchronously from atomic steps are allowed to merge with each other. As the domains expand laterally while maintaining alignment, they coalesce to form continuous bi-layer films that cover large substrate areas while preserving thickness uniformity throughout

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves centimeter-level, uniform, and continuous bi-layer TMDC films, suitable for high-performance electronic devices, with a simple, stable, and repeatable process.

Implementation Method 1

the uniform, continuous films of bi-layer TMDC are epitaxially grown on a sapphire substrate by the coalescence of bi-layer TMDC domains

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Implementation Method 2

The top and bottom layers of the domains synchronously nucleate at the high steps of the substrate

Methodology Applied
Scientific EffectNucleation: Nucleation

Implementation Method 3

the method for preparing uniform and continuous bi-layer TMDC films of the present invention includes a vapor deposition technique

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Implementation Method 4

A sapphire substrate is placed in a vapor deposition chamber at elevated temperatures, then gaseous sources are loaded into to trigger the material growth

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS12385140B2Method for uniform growth of bi-layer transition metal dichalcogenide continuous films
Publication Date: 2025.08.12 NANJING UNIV
  • US12385140B2 patent drawing
  • US12385140B2 patent drawing
  • US12385140B2 patent drawing

AI summary

A large-area, uniform, and continuous films of bi-layer transition metal dichalcogenide (TMDC) and preparation method comprises that the bi-layer TMDC continuous films are grown on a substrate through the merging of bi-layer domains; the top and bottom layers of the bi-layer domains have equal size and grow synchronously, which guarantees uniformity of the bi-layer films; the bi-layer domains were nucleated at the surface steps of the substrate which require a height no less than 0.8 nm; the bi-layer TMDCs films include molybdenum disulfide, tungsten disulfide, molybdenum diselenide, and tungsten diselenide, and the size of the bi-layer TMDC films reaches centimeter-level and above, limited only by the substrate size.