Uniform-Pore Filter Membrane for Semiconductor Particle Capture
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Solution Overview
Problem
Existing filter membranes used in semiconductor manufacturing often have random pore shapes and sizes, leading to inefficiencies in removing particles, which can result in defects and reduced yield in integrated circuit production.
Innovation Solution
A filter membrane with substantially uniform pore size is developed, featuring a base membrane with a plurality of through holes of controlled diameter and arrangement, optimized for effective particle capture and fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional filter membranes with random pore structures are used, then manufacturing is simpler, but particle removal efficiency deteriorates
Solution Approach 1:
The patent applies preliminary action by forming a sacrificial layer with a predetermined pattern before depositing the membrane material. This sacrificial layer serves as a template that guides the formation of uniform pores, ensuring precise pore placement and size control before the actual filter membrane is created
Solution Approach 2:
The patent uses a sacrificial layer as an intermediary element that temporarily exists during manufacturing to define the pore structure. This intermediate structure enables precise pore formation and is later removed, leaving behind the desired uniform pore pattern in the final filter membrane
2Productivity
If filter membranes with random pore sizes are used, then manufacturing is easier, but particle capture efficiency deteriorates
Solution Approach 1:
The patent applies segmentation by dividing the membrane into multiple functional layers, including a sacrificial layer with patterned features and a deposited membrane layer. This segmentation allows each layer to serve a specific function: the sacrificial layer defines pore locations and sizes, while the membrane layer provides filtration functionality
Solution Approach 2:
The patent utilizes parameter changes by controlling the dimensions, material properties, and deposition conditions of the sacrificial layer and membrane material. By adjusting parameters such as layer thickness, pattern geometry, and deposition parameters, precise control over pore size, shape, and distribution is achieved
3Productivity
If non-uniform pore distribution is used, then manufacturing is simpler, but fluid flow efficiency deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-establishing a uniform pore distribution pattern in the sacrificial layer before membrane deposition. This predetermined pattern ensures optimal fluid flow characteristics are built into the structure from the beginning, eliminating the need for post-manufacturing adjustments
Solution Approach 2:
The patent applies homogeneity by creating a uniform distribution of pores throughout the membrane structure. The sacrificial layer is designed with consistent spacing and dimensions, resulting in a homogeneous pore pattern that ensures uniform fluid flow and pressure distribution across the filter surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uniform pore size filter membrane enhances particle capturing efficiency, improves fluid flow, and reduces the risk of defects in semiconductor manufacturing, thereby increasing the yield of integrated circuits.
Implementation Method 1
Filters, in particular, point-of-use (POU) filters, are designed to remove contaminants or particles from the liquids, solutions, and/or solvents used in semiconductor integrated circuit manufacturing processes
Data Source
AI summary
A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane and a plurality of through holes.