Uniform Transistor Packages With Reconfigurable Bondwire Layouts

Solution Overview

Problem

Current semiconductor device packages for high-power, high-frequency applications, such as RF transistor amplifiers, face challenges in manufacturing complexity and cost due to the need for multiple different transistor dies and impedance matching circuits, which increases assembly complexity and costs.

Innovation Solution

The use of uniform transistor-based components with integrated passive device (IPD) circuits and tunable elements allows for the formation of reconfigurable amplifier packages by varying the bondwire configurations, reducing the number of distinct components and simplifying the manufacturing process while maintaining desired performance characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple different transistor dies and impedance matching circuits are used to achieve high-power, high-frequency performance, then the amplifier performance is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:

Improveamplifier performanceVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a single uniform transistor-based component that can serve multiple functions and configurations. The component includes a transistor die with integrated passive device (IPD) circuits and tunable elements that can be configured through different bondwire arrangements to create various amplifier packages with different power levels and frequency characteristics, eliminating the need for multiple different transistor dies and matching circuits

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies dynamics by incorporating tunable elements within the uniform transistor-based components that allow the amplifier characteristics to be adjusted after manufacturing. The bondwire configurations can be selectively arranged to change the electrical connections and thus the performance characteristics of the amplifier, enabling dynamic reconfiguration without changing the physical components

Inventive Principle:

Principle #15Dynamics

2Reliability

If multiple different transistor dies and impedance matching circuits are used to achieve desired performance characteristics, then the amplifier performance is improved, but the manufacturing cost increases

Engineering Contradiction:

Improveamplifier performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies universality by designing a single uniform transistor-based component that can serve multiple functions and configurations. The component includes a transistor die with integrated passive device (IPD) circuits and tunable elements that can be configured through different bondwire arrangements to create various amplifier packages with different power levels and frequency characteristics, eliminating the need for multiple different transistor dies and matching circuits

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies parameter changes by modifying the bondwire configurations connecting the uniform transistor-based components to change the electrical characteristics of the amplifier. By altering the connection parameters (which bonds are connected to which terminals), different performance characteristics are achieved without changing the physical components, thereby reducing manufacturing cost

Inventive Principle:

Principle #35Parameter changes

3Reliability

If multiple different transistor dies and impedance matching circuits are used to achieve desired performance characteristics, then the amplifier performance is improved, but the assembly complexity increases

Engineering Contradiction:

Improveamplifier performanceVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a single uniform transistor-based component that can serve multiple functions and configurations. The component includes a transistor die with integrated passive device (IPD) circuits and tunable elements that can be configured through different bondwire arrangements to create various amplifier packages with different power levels and frequency characteristics, eliminating the need for multiple different transistor dies and matching circuits

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies merging by combining the transistor die, IPD circuits, and tunable elements into a single uniform transistor-based component. This integration reduces the number of separate components that need to be assembled and simplifies the assembly process, as the uniform components can be arranged in different configurations without requiring complex assembly procedures

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12074149B2Device packages with uniform components and methods of forming the same

Publication Date: 2024.08.27 MACOM TECH SOLUTIONS HLDG INC

AI summary

A semiconductor device package includes a first and a second input lead and a plurality of uniform transistor-based components, the plurality of uniform transistor-based components comprising a first subset of the uniform transistor-based components coupled to the first input lead and a second subset of the uniform transistor-based components coupled to the second input lead. The first subset and the second subset are arranged in an asymmetric configuration with respect to one another.