Unit-Cell Pick-and-Place Layout for Uniform Component Binning
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Solution Overview
Problem
Existing pick-and-place processes for electrical components like LEDs result in non-uniform performance distribution on target substrates due to the transfer of performance variations from the source substrate, and high-throughput methods often compromise uniformity.
Innovation Solution
A method involving the construction of a binning map to assign electrical components to bins based on measured parameters, followed by arranging them on a target substrate with unit cells corresponding to these bins, ensuring uniform performance across the substrate while maintaining high throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical components are collected from source substrate and placed on target substrate using conventional pick-and-place process, then throughput is maintained high, but performance uniformity on target substrate deteriorates due to transfer of performance variations from source substrate
Solution Approach 1:
The target substrate is divided into multiple unit cells, and each unit cell is assigned a specific bin from the binning map. This segmentation allows different regions of the target substrate to receive components with matched performance characteristics, achieving uniformity across the entire substrate while maintaining high throughput production.
Solution Approach 2:
A binning map is constructed in advance by measuring performance parameters of all electrical components on the source substrate and assigning each component to a specific bin. This preliminary classification enables the pick-and-place process to systematically select components with matched performance characteristics, ensuring uniformity without compromising throughput.
2Manufacturing precision
If electrical components are sorted by performance parameters and arranged systematically on target substrate, then performance uniformity is improved, but process complexity increases
Solution Approach 1:
A binning map serves as an intermediary data structure that stores the relationship between component performance parameters and their assigned bins. This intermediary enables the controller to systematically manage the complex sorting and placement process by referencing pre-computed bin assignments, simplifying the control logic while achieving uniform performance distribution.
3Manufacturing precision
If all electrical components are measured and classified into bins before placement, then performance distribution control is improved, but processing time increases
Solution Approach 1:
Performance measurements and bin assignments are performed in advance during a preliminary characterization step. The binning map is constructed before the pick-and-place process, allowing the subsequent placement operation to proceed rapidly by simply following the pre-determined bin assignments, thus minimizing the time penalty for classification.
Solution Approach 2:
The measurement and classification process is integrated into the overall manufacturing flow, with the binning map construction occurring in parallel or during idle periods. This allows the useful action of characterizing components to continue without interrupting the main production throughput, minimizing time loss.
Data Source
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AI summary
Aspects of the present disclosure relate to a method for transferring a plurality of electrical components from a source substrate to a plurality of empty positions on a target substrate. Further aspects of the present disclosure relate to an apparatus for carrying out this method and to a corresponding computer program product. According to an aspect of the present disclosure a binning map is constructed of the source substrate by assigning each electrical component among the plurality of electrical components to a respective bin among M bins based on one or more parameters of the electrical components. The target substrate is divided into a plurality of unit cells, wherein each unit cell comprises a plurality of component positions, each component position being associated with a respective bin among the plurality of bins. The electrical components are arranged on the target substrate such that, at each component position of each unit cell, an electrical component from the source substrate is arranged that is assigned to the same bin as the bin that is associated with that component position.