Unit Pin Placement via Center-Line Intersection in Semiconductor Circuits
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Solution Overview
Problem
The complexity of semiconductor chip design makes it challenging to optimally position unit pins during the design process, particularly when considering wiring between units and internal unit structures, leading to inefficiencies in metal wire layer optimization.
Innovation Solution
A method and system that determine the optimal placement of unit pins by receiving pin position data, calculating the center point of a unit, extending a line from the center point through the chip pin position, and placing the unit pin at the intersection with the unit boundary, while avoiding overlaps and prioritizing placement based on design constraints and metal layer positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If unit pins are placed without considering wiring optimization, then placement is simple and fast, but wire length and wiring complexity increase
Solution Approach 1:
The patent applies preliminary action by determining optimal unit pin positions early in the design process, before detailed wiring is completed. The method calculates ideal pin locations based on unit geometry and anticipated connection requirements, establishing a foundation that simplifies subsequent wiring operations and reduces overall wiring complexity.
Solution Approach 2:
The patent utilizes parameter changes by dynamically adjusting pin placement parameters (position, orientation) based on multiple factors including unit shape, connection density, and wiring layer constraints. This optimization of placement parameters achieves better wiring efficiency without significantly impacting placement speed.
2Ease of manufacture
If unit pins are placed considering internal unit structure and wiring optimization, then wiring efficiency improves, but placement complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the complex pin placement problem into manageable components: analyzing unit geometry separately, determining connection requirements separately, and synthesizing optimal pin positions from these independent analyses. This modular approach improves wiring efficiency while keeping placement complexity manageable through systematic decomposition.
Solution Approach 2:
The patent introduces an intermediary optimization algorithm that mediates between unit structural requirements and wiring efficiency goals. This intermediary layer processes geometric and connectivity data to generate optimized pin placements, balancing the competing demands of structural integrity and wiring efficiency without requiring direct complex interactions between all design constraints.
3Ease of operation
If pin positions are fixed early in design, then design process is simpler, but flexibility for later optimizations is reduced
Solution Approach 1:
The patent implements dynamics by creating a multi-phase pin placement system where pin positions are determined in an initial phase based on geometric constraints, then refined in subsequent phases as wiring requirements become clearer. This dynamic, multi-stage approach maintains design simplicity early while preserving flexibility for later optimizations through iterative refinement.
Data Source
AI summary
A semiconductor circuit design method, system and computer program product for placing a unit pin on a boundary of a unit of a semiconductor circuit to be designed may be provided. Pin position data is received, wherein the pin position data comprises a chip pin position of a chip pin within the chip area and outside of the unit of a semiconductor circuit, to which the unit pin is to be electrically connected. The coordinates of a center point of the unit are determined, as well as a line crossing the center point and the chip pin position. The unit pin is placed on an intersection of the boundary of the unit and the line crossing the center point.