Unit Specific Progressive Alignment for Semiconductor Die
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Solution Overview
Problem
Semiconductor device manufacturing faces challenges in achieving precise alignment and packaging due to misalignment issues during the encapsulation process, which can lead to defective packages and reduced electrical connectivity.
Innovation Solution
The method of unit specific progressive alignment, which involves measuring the true position of semiconductor die within an embedded die panel, calculating the total radial shift, and distributing it across multiple layers to form a unit specific pattern, accounting for misalignment and ensuring accurate electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging processes are used without alignment compensation, then manufacturing complexity is reduced, but manufacturing precision deteriorates due to misalignment between semiconductor die and package edges
Solution Approach 1:
The patent measures the true position of semiconductor die before packaging and pre-calculates the radial shift that needs to be compensated. By performing this measurement and calculation step beforehand, the system prepares alignment compensation data that will be applied during subsequent packaging layers, preventing misalignment issues before they affect final package quality
Solution Approach 2:
The patent distributes the alignment compensation across multiple packaging layers (first packaging layer, second packaging layer, etc.) rather than attempting to correct all misalignment in a single step. Each layer compensates for a portion of the total radial shift, progressively achieving the required alignment accuracy through dimensional distribution in the vertical stacking direction
2Reliability
If misalignment compensation is not implemented, then device complexity remains low, but reliability deteriorates due to defective packages and poor electrical connectivity
Solution Approach 1:
The patent implements a feedback mechanism where the true position of semiconductor die is measured, the radial shift is calculated based on this measurement, and this information is then used to adjust the positioning of subsequent packaging layers. This closed-loop feedback ensures that actual misalignment is compensated based on real measurements rather than theoretical positions
Solution Approach 2:
The system pre-calculates the required compensation for each packaging layer based on measured die positions before actual packaging occurs. This preliminary preparation of alignment data ensures that when packaging layers are applied, they are positioned with the correct compensation already built in, preventing defects rather than attempting to fix them later
3Manufacturing precision
If radial shift is distributed across multiple layers, then manufacturing precision improves, but the number of process steps increases
Solution Approach 1:
The patent distributes the total radial shift compensation across multiple packaging layers, where each layer handles a portion of the required alignment correction. Rather than attempting to correct all misalignment in one excessive step, the system applies partial compensation at each layer, achieving the required precision through cumulative partial actions that are more manageable and controllable
Data Source
AI summary
A semiconductor device may include a semiconductor die disposed within an encapsulant, the semiconductor die being misaligned with a package edge formed by the encapsulant. A total radial shift of the semiconductor die may account for the misalignment between semiconductor die and the package edge. A build-up interconnect structure may comprise two or more layers formed over the semiconductor die and the encapsulant, the two or more layers comprising at least one redistribution layer (RDL). The total radial shift may be distributed over the two or more layers of the build-up interconnect structure to form a unit specific pattern for each of the two or more layers. An average misalignment of the semiconductor die and the package edge may be greater than the average misalignment of the at least one unit specific pattern with respect to the package edge.