Universal Block PCB for Wafer Probe Card Weight Reduction
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Solution Overview
Problem
Existing wafer test equipment is cumbersome and difficult to handle due to the weight and size of the probe card, which hinders efficient manual operation during electrical testing of semiconductor wafers.
Innovation Solution
The interface structure incorporates a universal block printed circuit board that connects signal lines directly to a probe card, reducing its weight and size by eliminating the need for a separate printed circuit board and optimizing signal and power line connections for stable transmission, with power lines divided into multiple paths for reduced impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a traditional probe card structure with separate printed circuit board is used, then signal and power connections are established, but the weight and size of the probe card increase making it cumbersome to handle
Solution Approach 1:
The patent combines the printed circuit board and probe card into a single integrated structure. The signal lines and power lines are directly connected to the probe card without requiring a separate printed circuit board, thereby reducing the overall weight and size while maintaining electrical connectivity functions.
Solution Approach 2:
The patent extracts and eliminates the separate printed circuit board component from the traditional probe card structure. By removing this redundant component and directly integrating the necessary electrical connections onto the probe card itself, the overall weight and complexity are reduced while preserving the essential testing functions.
2Reliability
If power signal lines are connected in a single path, then the structure is simple, but the impedance increases affecting signal transmission quality
Solution Approach 1:
The patent divides the power signal lines into multiple separate paths instead of using a single path. This segmentation reduces the impedance of each individual path and improves power distribution efficiency to the densely arranged signal terminals, while the modular layout keeps the overall design manageable.
Solution Approach 2:
The patent arranges power signal lines in a two-dimensional grid pattern across the probe card surface rather than using a single linear path. This spatial distribution across multiple dimensions reduces impedance and improves electrical performance while maintaining a compact and organized structure.
Data Source
AI summary
A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board. The probe card includes an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface.