Universal Chip Batch-Bonding Apparatus for Die-Up and Die-Down Mounting
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Solution Overview
Problem
Current chip bonding technologies require different apparatuses for die-up and die-down mounting manners, leading to increased production costs and limited application scope, while aiming for high bonding precision and productivity in chip-to-wafer technology.
Innovation Solution
A universal chip batch-bonding apparatus and method featuring a material pick-and-place area with blue tape and substrate pick-and-place sections, a transfer work area with chip pickup, alignment, and bonding sections, and a conveyor system that supports both die-up and die-down mounting manners, enabling modular configuration and expanded application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different bonding apparatuses are used for die-up and die-down mounting manners, then chip bonding precision can be maintained, but production costs increase and application scope is limited
Solution Approach 1:
The bonding apparatus is designed with a universal chip holder that can accommodate both die-up and die-down mounting manners through adjustable positioning structures. The chip holder includes positioning holes and clamping mechanisms that can be configured to hold chips in either orientation, allowing a single apparatus to perform multiple bonding functions without sacrificing precision for either mounting type.
2Manufacturing precision
If different bonding apparatuses are used for die-up and die-down mounting manners, then chip bonding precision can be maintained, but production costs increase
Solution Approach 1:
The bonding apparatus incorporates a universal chip holder with adjustable positioning structures that can accommodate both die-up and die-down mounting manners. This multi-functional design eliminates the need to purchase and maintain separate apparatuses for each mounting type, thereby reducing capital expenditure and operational costs while preserving bonding precision for both orientations.
Solution Approach 2:
The chip holder features dynamic adjustable positioning mechanisms that can be reconfigured between die-up and die-down modes. This dynamic adaptability allows the apparatus to switch between different mounting manners without requiring multiple fixed-configured machines, reducing overall system cost while maintaining precision through programmable positioning control.
3Manufacturing precision
If chip-to-wafer technology is used to achieve high bonding precision, then productivity may be compromised
Solution Approach 1:
The apparatus merges the precision alignment capabilities traditionally associated with slower processes with high-speed batch bonding capabilities. By integrating precision positioning systems with parallel batch processing, the system achieves high bonding precision across multiple chips simultaneously, thereby maintaining precision requirements while significantly improving overall productivity through parallelization.
Solution Approach 2:
The system performs preliminary alignment and positioning of chips on the universal holder before the actual bonding process. This pre-positioning ensures that precision requirements are met before batch bonding begins, allowing the subsequent bonding operation to proceed at high speed without compromising precision, thus resolving the trade-off between precision and productivity.
Data Source
AI summary
A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120). A chip carrier transfer apparatus (300) is provided in the transfer work area, and the chip carrier transfer apparatus (300) passes through the transfer work area and is used to move and supply materials among the chip pickup and separation area (210), the chip alignment and fine-tuning area (220), and the chip batch-bonding area (230). By means of a compatible design, the apparatus is suitable for both die-up and die-down attachment modes, expanding the application scope of the apparatus. In addition, the modular design can be configured according to requirements, increasing market potential.