Universal Circuit Board Contact Pattern for Semiconductor Packages
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Solution Overview
Problem
The existing technologies require unique circuit board contact patterns for each type of surface mounted semiconductor device package, leading to increased manufacturing complexity and inefficiency due to differences in contact patterns and numbers.
Innovation Solution
A universally usable contact pattern on the circuit board is designed to accommodate multiple possible patterns of solderable contact pads on semiconductor device dies, where unused contacts are insulated during fabrication, allowing the same circuit board pattern to support various semiconductor device packages with different layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If unique circuit board contact patterns are designed for each semiconductor device package type, then the contact pattern can precisely match the device requirements, but the manufacturing complexity and process variety increase
Solution Approach 1:
The circuit board is designed with a universal contact pattern that can accommodate multiple semiconductor device package types. The contact pattern includes a standard array of contact locations that can support different die configurations (e.g., 1x2, 2x2, 1x3, 2x3 arrangements). This allows a single circuit board design to interface with various device variants without requiring unique contact patterns for each package type, thereby reducing manufacturing complexity while maintaining precise electrical connections.
2Device complexity
If the circuit board contact pattern is designed to accommodate multiple device packages, then manufacturing complexity is reduced, but the precision for specific device contact alignment may be compromised
Solution Approach 1:
The universal contact pattern implements local quality by providing different contact configurations at specific locations on the circuit board. While the overall pattern is universal, each local contact region can be selectively activated or deactivated based on the specific device being mounted. This allows the circuit board to maintain precise alignment for various device types by enabling only the relevant contacts for each device configuration, thus preserving manufacturing precision while achieving universality.
3Adaptability or versatility
If different contact patterns are used for different device types, then each device can be optimized for its specific requirements, but the number of manufacturing processes increases
Solution Approach 1:
The circuit board employs a universal contact pattern that can accommodate multiple semiconductor device package types including different die configurations. This single versatile design replaces the need for multiple specialized contact patterns, allowing the manufacturing process to handle various device types (e.g., MOSFETs, IGBTs, diodes with different arrangements) using the same board layout, thereby improving manufacturing efficiency and productivity.
4Productivity
If a universal contact pattern is used on the circuit board, then manufacturing efficiency is improved, but the ability to optimize for specific device contact patterns is reduced
Solution Approach 1:
The universal contact pattern achieves device-specific optimization through local quality by selectively enabling or disabling specific contact regions based on the device being mounted. The circuit board maintains a comprehensive array of contact locations that can be configured to match different device requirements (e.g., activating only certain rows or columns for specific die arrangements), thus preserving adaptability while maintaining manufacturing efficiency through a single universal board design.
Data Source
AI summary
An apparatus for coupling a plurality of surface mounted semiconductor device packages to a circuit board is provided. Each package including a semiconductor device die and a metal clip including a flat web portion having a bottom surface and at least one peripheral rim portion extending from an edge of said flat web portion, said bottom surface having solderable planar metal electrodes or pads on its bottom surface, the contact pads being formed in plurality of layouts having one or more columns and one or more rows. The apparatus including a circuit board contact pattern including one or more columns and one or more rows of contacts, a number of rows being equal to a largest number of contact pad rows in the plurality of contact pad layouts, a number of columns being equal to a largest number of contact pad columns in the plurality of contact pad layouts. The circuit board contact pattern is usable by all of the plurality of the contact pad layouts of the plurality of semiconductor device packages.