Universal Circuit Board for Hermetic and Non-Hermetic Optical Modules
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Solution Overview
Problem
Existing optical transceivers face challenges in flexible design and maintenance due to varying form factors, which complicate the integration of electrical-to-mechanical interfaces in communication facilities, especially in high-speed networks.
Innovation Solution
The optical communication module features a circuit board with specific pin assignments that allow for compatibility with both hermetically sealing and non-hermetically sealing configurations, enabling the same production line fabrication for both types of modules, ensuring consistent power supply to optoelectronics through aligned pin arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different form factors are used to define electrical-to-mechanical interfaces, then flexibility in design and maintenance is improved, but device complexity and integration difficulty increase
Solution Approach 1:
The circuit board is designed with universal pin assignments that can interface with both hermetic and non-hermetic packaging configurations. The same circuit board can be used in different optical communication modules (e.g., XFP, QSFP) by accommodating different packaging types through standardized electrical interfaces, thereby reducing integration complexity while maintaining design flexibility.
2Reliability
If hermetic sealing is used for optical communication modules, then reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention enables the same circuit board to work with both hermetic and non-hermetic packaging by changing the packaging parameter while maintaining constant electrical interface parameters. The pin assignments and electrical characteristics remain unchanged, allowing manufacturers to produce different packaging types using the same production line and circuit board design, thus reducing manufacturing complexity.
3Ease of manufacture
If pin assignments are standardized across different packaging types, then ease of manufacture is improved, but adaptability to different configurations may be compromised
Solution Approach 1:
The circuit board incorporates universal pin assignments that serve multiple packaging configurations simultaneously. The electrical interfaces are designed with sufficient flexibility to accommodate both hermetic and non-hermetic packaging types, ensuring that the same circuit board can be manufactured with different packaging options without requiring rework or redesign, thus achieving both ease of manufacture and adaptability.
Data Source
AI summary
Related to an optical communication module, the optical communication module comprises a main body, an optical communication assembly and a second circuit board. The main body comprises a housing and a first circuit board disposed on the housing. The housing and the first circuit board together form an airtight cavity of the main body, and the first circuit board comprises two first electric interfaces. The optical communication assembly is accommodated in the airtight cavity and comprises a substrate, an optical communication element and a second electric interface. The optical communication element disposed on the substrate. One of the two first electric interfaces of the first circuit board is electrically connected to the second electric interface. The second circuit board comprises a third electric interface and the other one of the two first electric interfaces of the first circuit board is electrically connected to the third electric interface.