Universal Die Detachment Apparatus with Movable Pin Chuck
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Solution Overview
Problem
Existing die detachment tools are inadequate for handling both large and small semiconductor dice, particularly thin ones, as they often result in deformation or breakage due to pinching effects and inadequate peeling energy distribution, and require custom-made chucks for different sizes.
Innovation Solution
A universal die detachment apparatus with a movable pin chuck system that allows for adjustable placement of pre-peeling and ejector pins through a matrix arrangement of holes, enabling flexible configuration for various die sizes without the need for custom chucks, and utilizing a two-stage process to manage peeling and detachment effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single ejector pin is used to detach a die from adhesive tape, then the device complexity is reduced, but the reliability of detachment for large and thin dice deteriorates due to inadequate peeling energy distribution and pinching effects
Solution Approach 1:
The single ejector pin is segmented into multiple ejector pins arranged in a matrix pattern. This segmentation distributes the peeling energy across multiple contact points on the die, preventing localized pinching effects while maintaining overall device simplicity. The multiple pins work collectively to lift and detach the die from the adhesive tape without concentrating force on a single point.
Solution Approach 2:
The ejector pin system incorporates dynamic adjustment capabilities where the number, position, and depth of engaged pins can be varied based on die size and thickness. This dynamic configuration allows the same apparatus to reliably handle different die specifications by optimizing the distribution of peeling energy, thus maintaining high reliability across various die types without increasing inherent device complexity.
2Manufacturing precision
If custom-made chucks are created for different die sizes, then the manufacturing precision for specific die sizes is improved, but the device complexity and production time increase
Solution Approach 1:
A single universal chuck design incorporates a matrix arrangement of multiple ejector pins that can be selectively engaged or disengaged. This universal chuck replaces the need for multiple custom-made chucks for different die sizes. By selectively activating specific pins in the matrix, the same chuck achieves precise adaptation to various die sizes and shapes, maintaining manufacturing precision while eliminating the complexity of managing multiple specialized chucks.
Solution Approach 2:
The chuck system enables dynamic reconfiguration of the ejector pin matrix through selective engagement mechanisms. Operators can adjust which pins are active based on the specific die being processed, allowing one chuck to perform the function of multiple custom chucks. This dynamic adaptability provides precise size matching without requiring physical customization of the chuck for each die type.
3Reliability
If the number of ejector pins is increased to handle large dice, then the peeling energy distribution is improved, but the device complexity and pinching effects worsen
Solution Approach 1:
The ejector pin assembly is segmented into a modular matrix pattern where pins are distributed across the chuck surface in an organized grid. This segmentation allows systematic control over pin engagement, enabling improved peeling energy distribution across large dice while maintaining manageable assembly complexity through the regular, predictable pattern of the matrix arrangement.
Solution Approach 2:
Different regions of the ejector pin matrix can have different pin characteristics (such as engagement depth, diameter, or stiffness) tailored to local requirements. This local quality optimization ensures that pins in different positions provide appropriately distributed peeling energy for their specific location on the die, improving overall detachment reliability while keeping the total pin count and assembly complexity reasonable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively delaminates dice of different sizes with minimal deformation, allowing for reliable detachment of both large and small, thin dice by varying the number and arrangement of pins, reducing the need for custom-made chucks and enhancing the versatility of the tool.
Implementation Method 1
vacuum suction force provided from a vacuum channel through vacuum holes located on the ejector cap
Data Source
AI summary
A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.