Universal Hall Sensor Molded Component Design
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Solution Overview
Problem
Existing position detection devices require separate manufacturing processes and components for devices with two or single hall ICs, leading to increased costs and complexity in design and manufacturing.
Innovation Solution
A position detection device design that includes two components, each with a hall IC, wiring, and mold resin, which can be combined using a third mold resin to create a single unit, allowing for the use of either configuration depending on the number of ICs needed, thereby reducing manufacturing costs and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate primary molded products are designed and manufactured for position detection devices with different numbers of hall ICs, then the devices can be manufactured with appropriate components, but the design and manufacturing costs increase
Solution Approach 1:
The patent applies universality by designing a single primary molded product that can accommodate either one or two hall ICs. The molded product includes two mounting positions for hall ICs, and depending on the detection requirements, either one or both positions are populated with hall ICs. This universal design eliminates the need to create separate primary molded products for different configurations, thereby reducing design and manufacturing costs while maintaining adaptability to different numbers of hall ICs.
2Reliability
If separate primary molded products are stored for different configurations, then the correct components are available for each device type, but the parts control cost increases
Solution Approach 1:
By creating a universal primary molded product that can accommodate both single and dual hall IC configurations, the patent eliminates the need to maintain separate inventory for different device types. The same primary molded product is used regardless of whether one or two hall ICs are installed, significantly simplifying parts control and reducing inventory costs while ensuring the correct components are available for each device type.
3Strength
If a primary molded product is designed specifically for two hall ICs, then the structure can hold both ICs securely, but it cannot be used for a position detection device with a single hall IC
Solution Approach 1:
The primary molded product is designed with two mounting positions for hall ICs, both positions being structurally supported by the molded resin. This universal structure provides secure holding for either one or two hall ICs depending on the configuration required. The molded product includes through-holes for lead wires and mounting holes for screws, maintaining structural integrity and holding strength regardless of whether one or two hall ICs are installed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the common use of components across various position detection devices, reducing design and manufacturing costs while maintaining accuracy and protection of the ICs and wiring.
Implementation Method 1
a first mold resin molded to hold the first magnetism detection element and the first wiring
Data Source
AI summary
A position detection device includes a first component provided by molding of a first mold resin with a first hall IC, a second component provided by molding of a second mold resin with a second hall IC, a terminal connected to a first wiring of the first component and to a second wiring of the second component, and a third mold resin molded to hold and protect the first component, the second component and the terminal. The third mold resin fixing the first component and the second component to each other. Accordingly, the position detection device can be provided, which includes a component usable commonly for a variety of position detection devices which are different in the number of hall ICs.