Universal Hybrid Bonding Surface Layer for CMP Recipe Simplification
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Solution Overview
Problem
Existing hybrid bonding interfaces require multiple CMP recipes due to variations in metal density and pad dimensions, making it challenging to achieve uniformity and compatibility across different semiconductor dies and chiplets, which complicates the manufacturing process.
Innovation Solution
A universal hybrid bonding surface layer with a uniform metal density and pad layout is introduced, utilizing a redistribution layer to re-route pads and maintain compatibility, allowing for a single CMP recipe across various products, and adaptive lithography to correct alignment issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a universal hybrid bonding surface layer with uniform metal density is introduced, then CMP process complexity is reduced and manufacturing efficiency is improved, but additional redistribution layers and adaptive lithography steps are required
Solution Approach 1:
The patent implements a universal hybrid bonding surface layer that can be used across multiple product platforms and process nodes. By standardizing the bonding interface layer with uniform metal density and pad layout, the same CMP process parameters can be applied universally, eliminating the need for platform-specific tuning and enabling one CMP recipe to serve multiple purposes.
Solution Approach 2:
The patent introduces a redistribution layer as an intermediary between the existing pad layer and the hybrid bonding interface. This redistribution layer acts as a mediator that transforms various pad layouts into a standardized uniform grid pattern, allowing different underlying designs to interface with a common universal bonding surface without requiring changes to the bonding process itself.
2Manufacturing precision
If precise CMP is used to achieve high yield hybrid bonding, then bonding quality is improved, but the need for multiple CMP recipes increases process complexity
Solution Approach 1:
The patent enforces homogeneity in the hybrid bonding interface by requiring uniform metal density and standardized pad dimensions across the bonding surface. This homogeneous structure ensures that the CMP process encounters consistent material properties throughout, allowing a single set of CMP parameters to achieve high precision bonding yields without requiring multiple specialized recipes for different regions or products.
Solution Approach 2:
The patent performs preliminary actions by pre-establishing the uniform metal density and standardized pad layout in the redistribution layer before the hybrid bonding process. This preliminary standardization of the interface structure ensures that when CMP is applied, the process conditions are already optimized and consistent, eliminating the need for subsequent recipe adjustments and enabling high precision bonding from the outset.
3Adaptability or versatility
If pad layer layout and dimensions are varied for different products, then product-specific requirements are met, but CMP process tuning is required for each product
Solution Approach 1:
The patent segments the pad layer structure into two distinct functional parts: the underlying product-specific pad layer that can vary in layout and dimensions to meet different product requirements, and the upper universal hybrid bonding surface layer that maintains standardized uniform geometry. This segmentation allows each layer to fulfill its specific function independently, with the variation confined to the lower layer and the standardization maintained in the upper bonding interface.
Solution Approach 2:
The patent resolves the contradiction by adding a vertical dimension to the solution - creating a layered structure where product-specific variations exist in the lower dimensions (pad layer layout) while the upper dimension (hybrid bonding surface) maintains universal standards. This dimensional separation allows product diversity at one level while maintaining process uniformity at another level, eliminating the need for CMP recipe variations across products.
Data Source
AI summary
Embodiments disclosed herein include semiconductor dies with hybrid bonding layers and multi-die modules that are coupled together by hybrid bonding layers. In an embodiment, a semiconductor die comprises a die substrate, a pad layer over the die substrate, where the pad layer comprises first pads with a first dimension and a first pitch and second pads with a second dimension and a second pitch. In an embodiment, the semiconductor die further comprises a hybrid bonding layer over the pad layer. In an embodiment, the hybrid bonding layer comprises a dielectric layer, and an array of hybrid bonding pads in the dielectric layer, wherein the hybrid bonding pads comprise a third dimension and a third pitch.