Universal IC Packaging Pad Structure for Flexible Wire and Ball Bonding
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Solution Overview
Problem
The existing manufacturing process for integrated circuits requires multiple masks and complex inventory management due to the need for different packaging types, leading to increased costs and complexity in producing functionally identical ICs with varying packaging configurations.
Innovation Solution
A structure and method that includes a bump pad and a plurality of bond pads, each configured for independent electrical connection, with conductive traces to connect them, allowing for the selection of packaging types such as wire bonding or ball bonding using a common mask, enabling flexible packaging options without additional manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different masks are used for different packaging types, then packaging-specific connection requirements are met, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent implements a universal mask design where the uppermost metallization layer contains pad structures that can serve multiple packaging functions. Bond pads are configured to accommodate both wire bond and ball bond connections using the same mask, eliminating the need for packaging-specific masks. This multi-functional pad design allows a single mask to produce ICs suitable for different packaging types.
Solution Approach 2:
The uppermost metallization layer is segmented into distinct bond pads and bump pads with specific geometric configurations. Bond pads have shapes optimized for wire bonding while also accommodating ball bonding, and bump pads are positioned for flip-chip applications. This segmentation allows different connection types to be formed from a single unified mask pattern.
2Ease of manufacture
If packaging decisions are made at the beginning of wafer production, then manufacturing flow is simplified, but product inventory management complexity increases
Solution Approach 1:
The mask is designed in advance with predetermined pad configurations that enable multiple packaging options, but the actual packaging type selection is deferred to a later stage in the manufacturing process. This preliminary preparation of versatile pad structures allows flexible decision-making about packaging types after wafer fabrication is complete, reducing inventory complexity while maintaining manufacturing simplicity.
3Adaptability or versatility
If multiple versions of ICs are created for different packaging types, then specific packaging requirements are satisfied, but manufacturing cost increases due to additional masks
Solution Approach 1:
A single universal mask design replaces multiple packaging-specific masks. The mask incorporates bond pads with geometric features that satisfy both wire bonding and ball bonding requirements, as well as bump pads for flip-chip packaging. This eliminates the need to manufacture separate mask sets for different packaging types, reducing mask costs while maintaining support for multiple packaging options.
Data Source
AI summary
Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad. The present invention advantageously provides reduced manufacturing costs and reduced inventory management issues by enabling one device to be manufactured at a wafer level for a plurality of different packaging options, thereby enabling packaging decisions to be made at a later time in the manufacturing process.