Universal IC Test Socket With ML Pin Mapping Across Package Types

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Solution Overview

Problem

The challenge of identifying and testing counterfeit integrated circuit (IC) chips in the supply chain is complex due to the variety of chips and fast update speeds, making dedicated test circuits difficult to implement, and the risk of installing defective chips into critical systems is high.

Innovation Solution

A remotely controllable, automatic chip external pin configuration system that uses a universal socket, wireless communication, and a machine learning model to configure pin connections and timing settings, independent of chip package type, reducing setup time and human error.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a dedicated test circuit is built for each electronic chip, then testing accuracy is improved, but device complexity and manufacturing time increase

Engineering Contradiction:
Improvetesting accuracyVSAvoidtest circuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent implements a universal test circuit that can accommodate multiple chip types through configurable pin assignments and programmable logic. The test system uses a standardized socket interface with configurable connection matrices that can be programmed via PCB or software to match different chip pinouts, eliminating the need for dedicated hardware circuits for each chip type while maintaining testing accuracy

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The test circuit incorporates dynamic reconfiguration capabilities through programmable switch matrices and configurable pin assignments that can be changed via software or PCB settings. This allows the same physical test circuit to adapt its connectivity and test sequences dynamically based on the specific chip being tested, resolving the contradiction between dedicated circuit accuracy and circuit complexity

Inventive Principle:
Principle #15Dynamics

2Reliability

If stringent testing is performed on each chip, then reliability is improved, but testing time and productivity decrease

Engineering Contradiction:
Improvechip reliabilityVSAvoidtesting throughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system performs preliminary identification of the chip type and automatically loads the corresponding test configuration and pin assignments before actual testing begins. This preconfiguration step enables the system to execute appropriate test sequences without manual setup, maintaining thorough testing while reducing overall testing time through automated preparation

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The test system automatically identifies the chip type, selects appropriate test parameters, and configures pin assignments without requiring manual intervention for each chip. The system self-adapts to different chip types through automated recognition and configuration loading, maintaining reliability while increasing throughput by eliminating repetitive manual setup tasks

Inventive Principle:
Principle #25Self-service

3Adaptability or versatility

If manual configuration of pin connections is performed, then adaptability to different chips is improved, but human error and setup time increase

Engineering Contradiction:
Improvechip compatibilityVSAvoidsetup ease
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent replaces manual mechanical configuration of pin connections with automated electronic control through programmable switch matrices and software-controlled pin assignments. The system uses electronic configuration data stored in memory or databases to automatically set up the correct pin connections for each chip type, eliminating manual wiring or jumper placement while maintaining full adaptability to different chip configurations

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS12498416B2Systems and methods for testing integrated circuits independent of chip package configuration
Publication Date: 2025.12.16 GLOBAL ETS LLC
  • US12498416B2 patent drawing
  • US12498416B2 patent drawing
  • US12498416B2 patent drawing

AI summary

Systems and methods of testing integrated circuits independent of chip package configuration include or utilize a socket configured to receive a device under test (DUT), wherein the socket includes a plurality of input pins and a plurality of output pins, and wherein the DUT includes a plurality of device pins; a wireless communication device configured to wirelessly transmit information on the DUT to a server device operating a machine learning (ML) model, and wirelessly receive response data generated by the ML model from the server device, the response data including at least one of a pin configuration information of the DUT or a timing configuration information of the DUT; and a switch array configured to route respective ones of the plurality of device pins to corresponding ones of the plurality of output pins based on the response data.