Universal Orthopedic Implant Payload for Precise Sensor Alignment

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Solution Overview

Problem

Existing orthopedic implants with integrated electronics and sensors are limited by their specific sizes and configurations, making it difficult to integrate a universal component across various implant types during surgical implantation.

Innovation Solution

A universal payload with a housing, sensors, and a payload coupling feature that can be integrated into different orthopedic implants, including a payload receptacle, alignment, and securing mechanisms to ensure proper orientation and secure fit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If orthopedic implants are designed with specific sizes and configurations for different joints, then the implant performance and fit are optimized, but the ability to integrate a universal payload component across various implant types is reduced

Engineering Contradiction:
Improveuniversal payload integration capabilityVSAvoidimplant-specific configuration variety
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal payload component with a standardized form factor and coupling mechanism that can be integrated into multiple different orthopedic implant types (knee, shoulder, hip arthroscopy systems). The payload includes a standardized interface that accepts various implant configurations while maintaining consistent functionality, allowing a single payload design to serve multiple implant platforms without requiring reconfiguration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If electronics and sensors are built into implants during manufacturing, then the implant functionality is enhanced, but the flexibility to integrate such components at the time of surgical implant is reduced

Engineering Contradiction:
Improvesurgical integration flexibilityVSAvoidmanufacturing process rigidity
Core Design Contradiction:
Ease of operationVSEase of manufacture

Solution Approach 1:

The patent divides the implant system into two separate components: the orthopedic implant itself and the universal payload component. This segmentation allows the implant to be manufactured without integrated electronics, maintaining manufacturing simplicity, while enabling the payload (containing sensors and electronics) to be added separately during surgical implantation. The payload can be selectively attached to different implant types at the time of surgery, providing operational flexibility.

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If a universal payload is designed to fit multiple implant types, then the adaptability is improved, but the precision of sensor orientation and alignment may be compromised

Engineering Contradiction:
Improvecompatibility with multiple implant typesVSAvoidsensor alignment accuracy
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent employs asymmetric alignment features on the universal payload that complement specific asymmetric receptacles in different implant types. Each implant type has a uniquely shaped receptacle with corresponding alignment features (such as protrusions, recesses, or geometric keyways) that guide the payload into the correct orientation. This asymmetric pairing ensures precise sensor alignment for each specific implant type while maintaining the universal design capability across multiple implant platforms.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS20250241587A1Universal payload for integration with each of a plurality of different orthopedic implants having a payload receptacle
Publication Date: 2025.07.31 CANARAY MEDICAL INC
  • US20250241587A1 patent drawing
  • US20250241587A1 patent drawing
  • US20250241587A1 patent drawing

AI summary

A universal payload may be integrated with each of a plurality of different orthopedic implants configured to replace or functionally supplement a natural joint of a body. In one aspect, a universal payload includes an electronics assembly, a housing enclosing the electronics assembly, and a payload coupling feature configured to couple to each of a plurality of different orthopedic implants. The electronics assembly includes at least one sensor and a controller having at least two joint-specific modules. Each joint-specific module is respectively configured to collect kinematic data resulting from movement of a respective specific joint sensed by the at least one sensor. In another aspect, a universal payload includes an electronics assembly comprising at least one sensor and a housing enclosing the electronics assembly. The universal payload has a payload form factor that is configured to be at least partially inserted into a payload receptacle in each of a plurality of different orthopedic implants.