Universal Interposer Layout for Mixed Bond Pad Density ICs

Solution Overview

Problem

The development of application-specific interposers for each new chip package design is costly and time-consuming due to the need for unique bond pad layouts, limiting design flexibility and increasing lead time in multi-die integrated circuits.

Innovation Solution

A universal interposer with multiple regions, each featuring distinct bond pad layouts, allowing for the attachment of IC devices with varying bond pad densities, enabling a single interposer design to accommodate multiple types of IC devices with different functionalities, such as memory, processing, and transceivers, and providing scalable and efficient space utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If application-specific interposers are designed for each new chip package design, then the bond pad layout can be optimized for each specific IC device, but the development cost and design lead time increase significantly

Engineering Contradiction:

Improvebond pad layout optimizationVSAvoiddesign lead time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The interposer is designed with multiple regions, each containing slots with different bond pad layouts that can accommodate various IC device types. This universal design allows a single interposer to interface with multiple different IC devices having varying bond pad densities, eliminating the need for application-specific interposer designs while maintaining optimized bond pad layouts for each device type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The interposer body is divided into multiple regions, where each region contains slots with distinct bond pad layouts. This segmentation allows different portions of the interposer to be optimized for different IC device types (e.g., memory, processing, transceivers) while using a single unified interposer structure, thereby reducing development time and cost.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If application-specific interposers are designed for each new chip package design, then the bond pad layout can be optimized for each specific IC device, but the development cost increases

Engineering Contradiction:

Improvebond pad layout optimizationVSAvoiddevelopment cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The interposer is designed with multiple regions, each containing slots with different bond pad layouts that can accommodate various IC device types. This universal design allows a single interposer to interface with multiple different IC devices having varying bond pad densities, eliminating the need for application-specific interposer designs while maintaining optimized bond pad layouts for each device type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple bond pad layout configurations that would traditionally require separate interposer designs are merged into a single interposer structure with multiple regions. Each region contains slots with distinct bond pad layouts, allowing the interposer to serve multiple IC device types simultaneously, thereby reducing development costs while maintaining manufacturing precision.

Inventive Principle:

Principle #5Merging (Combining)

3Loss of time

If a single interposer design is used to accommodate multiple IC device types, then development cost and time are reduced, but the bond pad layout must be generalized to work with varying bond pad densities

Engineering Contradiction:

Improvedesign lead timeVSAvoidbond pad layout optimization

Core Design Contradiction:

Loss of timeVSManufacturing precision

Solution Approach 1:

The interposer body is divided into multiple regions, where each region contains slots with distinct bond pad layouts. This segmentation allows different portions of the interposer to be optimized for different IC device types (e.g., memory, processing, transceivers) while using a single unified interposer structure, thereby reducing development time and cost.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the interposer have locally optimized bond pad layouts tailored to specific IC device types. The first region has slots with bond pad layouts optimized for one type of IC device, while the second region has slots with bond pad layouts optimized for another type, allowing each local area to maintain manufacturing precision while the overall design serves multiple applications.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11901300B2Universal interposer for a semiconductor package

Publication Date: 2024.02.13 XILINX INC

AI summary

A universal interposer for an integrated circuit (IC) device has a body having a first surface and a second surface opposite the first surface. A first region is formed on a first side of the body along a first edge. The first region has first slots, each having an identical first bond pad layout. A second region is formed on the first side along a second edge, opposite the first edge. The second region has second slots having an identical second bond pad layout. A third region having third slots is formed on the first side between the first and second regions, each slot having an identical third bond pad layout. A pad density of the third bond pad layout is greater than the first bond pad layout. One of the third slots is coupled to contact pads disposed in a region not directly below any of the second slots.