Universal I/O Module With Detachable Option Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing process control systems require a large number of I/O modules to accommodate various field devices, leading to increased costs due to the need for multiple dedicated modules, especially for devices using Foundation Fieldbus and thermocouple signals, which are not compatible with universal I/O modules.
Innovation Solution
An I/O module design featuring a base plate with universal circuits and detachable option modules that include signal processing and communication capabilities, allowing connection of multiple field devices types through a single module by using photocouplers and microprocessors for protocol conversion and signal amplification, while identifying the type of option module for automatic setting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If universal I/O modules are used to connect majority of field devices, then the total number of I/O modules decreases and cost is reduced, but field devices requiring special processing (Foundation Fieldbus, thermocouple) cannot be connected
Solution Approach 1:
The I/O module is divided into a base module containing universal circuits and an option module that can be selectively attached. The base module handles common field devices, while the option module provides specialized processing for Foundation Fieldbus and thermocouple devices. This segmentation allows the system to maintain simplicity for common cases while adding capability only when needed.
Solution Approach 2:
The base I/O module is designed with universal circuits that can handle the majority of field device types (analog, discrete signals). This universal design reduces the total number of I/O modules needed while the detachable option module extends this universality to include specialized device types without permanently increasing base complexity.
2Adaptability or versatility
If dedicated I/O modules are provided for each field device type, then all field devices can be connected, but the total number of I/O modules increases and cost increases
Solution Approach 1:
Multiple I/O module functions are merged into a single integrated module. The base module combines universal input/output circuits, while the option module merges specialized processing capabilities for Foundation Fieldbus and thermocouple devices. This merging reduces the total quantity of I/O modules from multiple dedicated modules to a single configurable module.
Solution Approach 2:
The I/O module is designed as a universal platform that can accommodate multiple field device types through the base module's universal circuits and the option module's specialized interfaces. This multi-functionality eliminates the need for multiple separate dedicated modules, reducing both quantity and cost.
3Adaptability or versatility
If option modules are detachably provided in the base plate, then more types of field devices can be connected, but the device complexity and manufacturing complexity increase
Solution Approach 1:
The I/O module is segmented into a standardized base module and a detachable option module. This segmentation allows each module to be manufactured independently using standardized processes, reducing overall manufacturing complexity despite the increased versatility. The detachable design simplifies assembly and maintenance.
4Adaptability or versatility
If the option module includes signal processing and communication capabilities, then more field devices can be connected, but the area and consumed power increase
Solution Approach 1:
Power-intensive signal processing and communication capabilities are segmented into the detachable option module rather than being permanently integrated into the base module. This allows the base module to consume minimal power for basic I/O operations, while the option module's advanced capabilities are only active when the option module is physically attached and needed, reducing overall power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables connection of a greater variety of field devices than ever before, reducing the overall number of I/O modules and costs, while maintaining system reliability and ease of maintenance through modular design and automatic module identification.
Implementation Method 1
The first circuit may be configured to connect the first connection terminal and the first universal circuit to enable transmitting and receiving of signals between the first connection terminal and the first universal circuit while electrically insulating a connection between the first connection terminal and the first universal circuit
Data Source
AI summary
An I/O module includes a base plate, a plurality of universal circuits, and an option module. The base plate includes a plurality of connection terminals. A plurality of field devices is electrically connectable to the connection terminals. The universal circuits correspond to the connection terminals. The universal circuits are provided on the base plate, and configured to perform an input of analog signals from the field device, an output of analog signals to the field device, an input of discrete signals from the field device, and an output of discrete signals to the field device. The option module is detachably provided in the base plate. The option module is provided between a first connection terminal of the connection terminals and a first universal circuit of the universal circuits. The option module includes a first circuit configured to performing transmitting and receiving of signals between the first connection terminal and the first universal circuit. The first connection terminal corresponds to the first universal circuit.