Universal Leadframe Assembly for Multi-Pin Count Semiconductor Packages
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Solution Overview
Problem
The existing semiconductor package fabrication process requires different sets of tools for various pin-count dies, leading to high costs and time-consuming tool changes when switching between different pin counts, as each set is specific to the number of leads on the leadframe assembly.
Innovation Solution
A universal leadframe assembly design with consistent inter-lead spacing allows for the use of a common tool set across different pin-count dies, eliminating the need for multiple tool sets and enabling efficient production line changes by maintaining uniform lead spacing and orthogonal die placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different sets of tools are used for different pin-count dies, then the leadframe assembly can be processed accurately for each specific pin count, but the device complexity and production cost increase due to maintaining multiple tool sets
Solution Approach 1:
The leadframe assembly is designed with a standardized configuration where leads are uniformly spaced at consistent intervals along each side. This universal spacing pattern allows a single set of punching tools to process leadframes with different pin counts (e.g., 8-pin, 14-pin, 16-pin) without requiring tool changes, thereby reducing device complexity while maintaining manufacturing precision through the consistent geometric pattern
Solution Approach 2:
The invention changes the parameter of lead spacing from variable (different for each pin count) to constant (uniform across all pin counts). By maintaining a fixed spacing distance between adjacent leads regardless of the total number of pins, the system allows different pin-count configurations to be accommodated using the same tooling, thus reducing the number of tool sets required
2Manufacturing precision
If different sets of tools are used for different pin-count dies, then each pin count can be optimized for its specific configuration, but the production time increases due to tool changes when switching between pin counts
Solution Approach 1:
The standardized leadframe design with uniform lead spacing creates a universal platform that can be processed by a single tool set for multiple pin-count configurations. This eliminates the need to change tools when switching between different pin counts, thereby reducing production time while still allowing optimization for specific pin counts through the consistent geometric pattern that accommodates various die configurations
3Manufacturing precision
If different sets of tools are used for different pin-count dies, then each tool set can be customized for its specific application, but the production cost increases due to the expense of multiple tool sets
Solution Approach 1:
The invention creates a universal leadframe design with consistent lead spacing that can be processed by a single tool set for multiple pin-count configurations. This eliminates the need to manufacture and maintain multiple specialized tool sets, thereby reducing production costs while still allowing customization for specific applications through the flexible accommodation of different pin counts using the same standardized tooling
Data Source
AI summary
A method includes forming a leadframe assembly to have a pair of opposing sides, and having semiconductor die receiving portions extending between the opposing sides. The method also includes placing semiconductor dies on the leadframe assembly in the die receiving portions. Each die has a row of leads on each of two opposing sides of the die and a longitudinal axis parallel to the rows of leads. The longitudinal axis of each die is orthogonal to the opposing sides of the leadframe assembly. The method further includes applying mold compound to the semiconductor dies. The method includes punching through the leadframe assembly between the opposing sides using a first tool having a first tool longitudinal axis parallel to longitudinal axes of the dies.