Universal Mold for Encapsulated Electronic Packages
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Solution Overview
Problem
The high fabrication cost of semiconductor packages due to the need for molds with specific shapes that match various specifications, leading to increased development costs for packaging resin.
Innovation Solution
A method involving packaging structures placed on a supporting plate with a uniform specification, where an encapsulation layer is formed, and a singulation process is performed, allowing for the development of a mold based on the supporting plate's specification rather than the package's, reducing the need for multiple mold specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a mold is developed for each specific semiconductor package specification, then the packaging process can accommodate various package types, but the fabrication cost and development cost increase significantly
Solution Approach 1:
The patent applies universality by developing a single mold that can form encapsulation layers for semiconductor packages of different specifications. The mold is designed with a cavity that can accommodate multiple package types through flexible positioning of carriers on a supporting plate, eliminating the need for multiple specialized molds and thereby reducing fabrication and development costs while maintaining adaptability to various package specifications.
2Adaptability or versatility
If multiple molds with different specifications are developed for different package types, then various package specifications can be met, but the number of molds and associated complexity increases
Solution Approach 1:
The invention implements universality by creating a single multi-functional mold that can produce encapsulation layers for different package specifications. The mold cavity is designed to accommodate various carrier sizes and configurations through a standardized supporting plate system, allowing one mold to replace multiple specialized molds and thereby reducing overall system complexity.
Solution Approach 2:
The patent applies segmentation by dividing the packaging structure into modular components: a standardized supporting plate with positioning structures, adjustable carrier placements, and a universal mold cavity. This segmentation allows the same mold to accommodate different package specifications by reconfiguring the positions of carriers on the supporting plate, rather than requiring dedicated molds for each specification.
3Ease of manufacture
If a single mold specification is used for all package types, then the fabrication cost is reduced, but the ability to produce different package specifications is limited
Solution Approach 1:
The patent resolves this contradiction by designing a universal mold with a cavity that can accommodate multiple package specifications through a standardized supporting plate system. The supporting plate includes positioning structures that allow carriers of different sizes and configurations to be placed in appropriate positions, enabling a single mold to produce various package types while maintaining cost efficiency.
Solution Approach 2:
The invention applies dynamics by making the carrier positioning flexible rather than fixed. The supporting plate allows carriers to be positioned at different locations and orientations depending on the package specification being produced. This dynamic reconfigurability enables a single mold to adapt to different package types without sacrificing manufacturing cost efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication costs by enabling the production of electronic packages with different specifications using a single mold design for the encapsulation layer, lowering overall production expenses.
Implementation Method 1
the second surface of the carrier is bonded to the supporting plate via a bonding layer
Data Source
AI summary
A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.