Universal Semiconductor Package Molds for Mixed Lead Frame Dies
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Solution Overview
Problem
The existing semiconductor packaging process is inefficient and expensive due to the need for multiple molds to accommodate different types of semiconductor dies with varying numbers of metal contacts, limiting flexibility and increasing costs.
Innovation Solution
A universal pair of semiconductor packaging molds that can accommodate varying numbers and types of dies by using a lead frame with multiple dies positioned in a column, allowing for a single continuous block of mold compound to encapsulate each column of dies, which can then be singulated into individual packages, regardless of the number of metal contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple molds are used to accommodate different types of semiconductor dies with varying numbers of metal contacts, then each die type can be packaged with dedicated molds ensuring precision, but the device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent applies universality by designing a single mold cavity configuration that can accommodate semiconductor dies with different numbers of metal contacts (e.g., 6, 8, 10, or 12 contacts). The mold includes a cavity with a bottom surface and side walls that can adapt to various die types, eliminating the need for multiple dedicated mold sets while maintaining packaging precision through consistent cavity geometry and mold compound injection processes.
2Reliability
If multiple mold sets are purchased to accommodate different die types, then packaging flexibility is reduced for each specific die type, but the manufacturing cost increases due to purchasing and maintaining multiple mold sets
Solution Approach 1:
The patent reduces manufacturing cost by using a single universal mold set instead of multiple dedicated mold sets. The universal mold maintains packaging consistency through its standardized cavity design that accommodates various die types with different metal contact configurations, thereby achieving both cost reduction and consistent packaging quality without requiring multiple mold sets.
3Productivity
If a single continuous block of mold compound encapsulates each column of dies, then the packaging process is simplified and efficiency is improved, but the ability to accommodate different die configurations is limited
Solution Approach 1:
The patent achieves both packaging efficiency and die configuration flexibility through a universal mold cavity design. The cavity with its bottom surface and side walls can adapt to different die configurations (varying numbers of metal contacts), while still allowing a single continuous block of mold compound to encapsulate each column of dies. This universal design maintains productivity by using continuous injection molding while accommodating versatility in die arrangements.
Data Source
AI summary
A method of making semiconductor packages includes providing a first lead frame having a first plurality of semiconductor dies arranged along a first longitudinal axis, each of the first plurality of semiconductor dies having a first number of metal contacts; providing a second lead frame having a second plurality of semiconductor dies arranged along a second longitudinal axis, each of the second plurality of semiconductor dies having a second number of metal contacts, the second number of metal contacts different than the first number of metal contacts; and covering the first plurality of semiconductor dies in a first mold using a common semiconductor die cavity; covering the second plurality of semiconductor dies in a second mold using the common semiconductor die cavity.