Universal Package Substrate for Multi-SSIT Compatibility
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Solution Overview
Problem
Current Stacked Silicon Interconnect Technology (SSIT) requires unique package substrates for each SSIT product, even when products have similar device patterns and package footprints, leading to increased design efforts and packaging costs, and longer time to market.
Innovation Solution
Designing a package substrate compatible with multiple SSIT products by ensuring compatibility in top die configurations, interposer patterns, and package footprints, allowing for the reuse of a single substrate type across different SSIT products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a unique package substrate is designed for each SSIT product, then device compatibility and performance are ensured, but design efforts increase, packaging costs increase, and time to market increases
Solution Approach 1:
The patent applies universality by designing a single package substrate type that can accommodate multiple SSIT products with different top die configurations. The substrate includes standardized interposer patterns, C4 bump configurations, and package footprints that work across different device variants, eliminating the need for unique substrates for each product while maintaining compatibility and performance.
2Reliability
If a unique package substrate is designed for each SSIT product, then device compatibility and performance are ensured, but packaging costs increase
Solution Approach 1:
The patent reduces packaging costs by enabling a single substrate design to serve multiple SSIT products. This universality allows for economies of scale in substrate manufacturing, reduces the variety of inventory needed, and simplifies the packaging process across different device variants while maintaining proper electrical and mechanical connections.
3Reliability
If a unique package substrate is designed for each SSIT product, then device compatibility and performance are ensured, but time to market increases
Solution Approach 1:
The patent accelerates time to market by establishing a universal package substrate platform that can be reused across multiple SSIT products. This eliminates the need to design, qualify, and manufacture unique substrates for each device variant, allowing new products to leverage existing validated substrate designs and rapidly bring innovations to market.
4Device complexity
If a single package substrate type is shared across multiple SSIT products, then design efforts are minimized and costs are reduced, but compatibility challenges arise between different top die configurations
Solution Approach 1:
The patent resolves compatibility challenges by implementing local quality variations on the universal substrate. Different regions of the substrate are designed with specific interposer patterns, C4 bump configurations, and electrical connections tailored to accommodate different top die configurations, while maintaining a consistent overall substrate architecture and package footprint.
Data Source
AI summary
An apparatus includes a package substrate for a first SSIT product with a first top die configuration, wherein the package substrate is compatible with a second SSIT product with a second top die configuration, and wherein the first top die configuration is different from the second top die configuration.