Universal Physical Layer Logic for Multi-Standard Interface Compatibility

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

System-on-chip (SoC) and integrated circuit (IC) solutions face challenges in efficiently utilizing and accessing IC resources such as die area and contacts due to the need for multiple interface specifications for audio-video communication, leading to a premium on resources and a demand for new solutions to optimize their use.

Innovation Solution

The implementation of circuit logic that receives digital audio-video information processed according to a first interface specification and generates analog signals compatible with a second interface specification, allowing for the inclusion of multiple interface specifications in individual IC dies or packages without requiring separate physical layer logic for each specification, and enabling the offloading or elimination of physical layer hardware.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate physical layer logic is implemented for each interface specification, then communication compatibility across different standards is achieved, but die area and contact resources are consumed excessively

Engineering Contradiction:
Improveinterface specification compatibilityVSAvoiddie area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent implements a universal physical layer logic block that can operate with multiple interface specifications (HDMI, DisplayPort, USB Type-C) through configuration signals. This single multi-functional block replaces what would traditionally require separate dedicated physical layer logic for each standard, thereby reducing die area while maintaining compatibility across different interface specifications.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges multiple interface specification support into a single integrated physical layer logic block. By combining the functionality of separate HDMI PHY, DisplayPort PHY, and USB Type-C PHY into one shared resource that can be dynamically configured, the design reduces the total die area occupied by physical layer logic while preserving support for all required interface standards.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If multiple interface specifications are supported in individual IC dies, then communication versatility is improved, but IC resources such as contacts and die area are consumed

Engineering Contradiction:
Improveinterface specification supportVSAvoidIC resource consumption
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The physical layer logic is designed as a universal block that can be configured to support multiple interface specifications through control signals and configuration registers. This multi-functional approach allows a single physical layer block to replace multiple dedicated blocks, reducing contact usage and die area while maintaining support for HDMI, DisplayPort, USB Type-C, and other interface standards.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent employs dynamic configuration mechanisms where the physical layer logic can be reconfigured at runtime to support different interface specifications. Configuration signals and control registers allow the same physical layer hardware to adapt its behavior and interface characteristics dynamically, enabling versatile multi-standard support without requiring separate static hardware for each standard.

Inventive Principle:
Principle #15Dynamics

3Reliability

If physical layer logic is integrated for each interface specification, then communication functionality is complete, but contact usage and die area increase

Engineering Contradiction:
Improvecommunication functionalityVSAvoidcontact usage
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent implements a universal physical layer logic block that serves multiple interface specifications through configuration mechanisms. This single multi-functional block provides the necessary communication functionality for HDMI, DisplayPort, USB Type-C, and other standards while using a shared set of contacts and die area, thereby reducing the quantity of physical resources required compared to having separate dedicated physical layer logic for each standard.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9270929B2Formatting audio-video information compliant with first transmission format to second transmission format in integrated circuit for offloading physical layer logic for first transmission format to separate integrated circuit
Publication Date: 2016.02.23 LATTICE SEMICON CORP
  • US9270929B2 patent drawing
  • US9270929B2 patent drawing
  • US9270929B2 patent drawing

AI summary

Techniques and mechanisms for formatting digital audio-video (“AV”) information. In an embodiment, interface logic includes circuitry to receive digital AV information which, in one or more respects, is according to or otherwise compatible with a first interface specification. The interface logic changes a format of the digital AV information to allow for subsequent physical layer processing which is according to a second interface specification. In another embodiment, conversion logic receives analog signals according to the second interface specification and, based on such analog signals, performs digital information processing for subsequent generation of other analog signals to be transmitted according to the first interface specification.