Universal Ruggedized Computer Enclosure for Liquid Cooling and Upgrades
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Solution Overview
Problem
Existing COTS ruggedized computers are inefficient in terms of space, power, and hardware upgradeability, and lack the necessary cooling and shock protection for harsh environments, making them unsuitable for heavy software development and unmanned ground vehicle robotics.
Innovation Solution
A universal ruggedized system enclosure that integrates high-performance non-ruggedized computers with expansion accessories, featuring integrated water cooling, a heat exchanger, positive pressure system, and adjustable air suspension for shock protection, along with a unique mounting method for PCIe expansion cards, reducing the form factor and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If COTS ruggedized computers are used, then reliability in harsh environments is improved, but compute performance and hardware upgradeability deteriorate
Solution Approach 1:
The system divides the computer into modular components (motherboard, power supply, cooling system, enclosure) that can be independently selected and replaced. The motherboard is housed in a standardized enclosure that accepts different motherboards and expansion cards, enabling hardware upgrades while maintaining the ruggedized enclosure's protective functions.
Solution Approach 2:
The enclosure is designed as a universal platform that can accommodate multiple motherboard types and PCIe expansion cards through standardized mounting interfaces. This allows a single ruggedized enclosure to support different compute configurations for varying performance requirements while maintaining environmental protection.
2Temperature
If integrated water cooling is implemented, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The water cooling system is integrated directly into the enclosure structure, merging the cooling function with the housing. The heat exchanger is built into the enclosure walls, and coolant channels are incorporated into the structural components, eliminating separate cooling assemblies and reducing overall system complexity despite the advanced cooling capability.
Solution Approach 2:
The system uses a closed-loop liquid cooling system with coolant flowing through channels in the motherboard mounting plate and heat exchanger. This hydraulic approach provides efficient heat removal from high-performance components while the integrated design minimizes the number of external parts and connections required.
3Temperature
If air conditioning units or peltier devices are used for cooling, then temperature control is improved, but power consumption and space requirements increase
Solution Approach 1:
The water cooling system leverages the vehicle's existing coolant circulation to provide cooling, eliminating the need for dedicated power-consuming cooling devices. The integrated heat exchanger uses the vehicle's thermal management infrastructure, converting an available resource into a cooling solution without requiring additional power input.
4Power
If desktop computer form factor is used, then compute performance is improved, but space efficiency and shock protection deteriorate
Solution Approach 1:
The computer components are nested within a compact enclosure that fits into the vehicle's existing infrastructure. The motherboard, power supply, and cooling components are arranged in a space-efficient configuration where smaller components are positioned within the volume occupied by larger structural elements of the enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enclosure provides efficient cooling and protection in harsh environments, allowing for easy integration and upgradeability, while reducing space and power consumption, and ensuring reliable operation in rugged conditions.
Implementation Method 1
an enclosure wall structure including therein a heater exchanger, a pipe to direct a cooling liquid through the heat exchanger, and a ducting to direct a gas through the heat exchanger to be cooled by the cooling liquid
Implementation Method 2
a pipe to direct a cooling liquid through the heat exchanger, and a ducting to direct a gas through the heat exchanger to be cooled by the cooling liquid
Data Source
AI summary
In one embodiment, an enclosure device for a printed circuit board (PCB) comprises: an enclosure wall structure including therein a heater exchanger, a pipe to direct a cooling liquid through the heat exchanger, and a ducting to direct a gas through the heat exchanger to be cooled by the cooling liquid; and a PCB space adjacent to a portion of the enclosure wall structure for receiving the PCB. The ducting includes a downstream duct disposed downstream of the heat exchanger and extending through the portion of the enclosure wall structure adjacent to the PCB space to direct the cooled gas to the portion of the enclosure wall structure adjacent to the PCB space.