Universal Server Card Carrier for E1S and NF1 SSDs
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Solution Overview
Problem
Current server designs cannot accommodate both E1S and NF1 form factor SSD cards simultaneously due to their different footprints, requiring separate carriers and limited cooling solutions, which restricts the use of next-generation storage cards with higher power consumption.
Innovation Solution
A common carrier design with a toolless mechanism and enhanced heat dissipation capabilities, featuring registration features for different card types and a heat sink with increased surface area to accommodate both E1S and NF1 cards, allowing for efficient installation and cooling without the need for additional tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate carriers are designed for E1S and NF1 form factor cards, then each card type can be properly accommodated, but the device complexity increases and adaptability decreases
Solution Approach 1:
The patent applies universality by designing a single carrier that can accommodate both E1S and NF1 form factor cards through multiple registration feature sets. The carrier includes a first set of registration features for E1S cards and a second set for NF1 cards, allowing one carrier to serve multiple card types without requiring separate specialized carriers for each form factor.
2Reliability
If separate carriers are designed for different card types, then each card can be properly secured, but the device complexity increases
Solution Approach 1:
The patent reduces device complexity by consolidating multiple carrier designs into a single universal carrier. This carrier incorporates multiple registration feature sets that can accommodate different card types, eliminating the need to maintain separate carrier inventories for E1S and NF1 cards while ensuring reliable secure mounting for each card type.
3Device complexity
If standard heat sinks are used in carriers, then the carrier design is simple, but the heat dissipation capability is insufficient for high power cards
Solution Approach 1:
The patent applies local quality by providing different heat sink configurations for different card types. The carrier includes a first heat sink for E1S cards and a second heat sink for NF1 cards, allowing each card type to receive appropriate thermal management tailored to its specific power consumption and heat generation characteristics.
Solution Approach 2:
The patent implements dynamics by making the heat sink configuration adaptable to the inserted card type. The carrier can dynamically provide the appropriate heat sink based on which card is installed, ensuring optimal thermal management for high power cards while maintaining design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the simultaneous use of E1S and NF1 cards in a single server with improved heat dissipation, addressing the limitations of existing carriers by providing a foolproof, toolless installation and enhanced thermal management for higher power cards.
Implementation Method 1
Heat sinks are typically composed of thermally conductive material. Heat sinks absorb the heat from the electronic components, thus transferring the heat away from the components.
Data Source
AI summary
A common carrier for different device cards for installation in a server is disclosed. The common carrier has a base module that includes side walls and a bottom panel. The bottom panel has a plurality of registration features, each of the registration features corresponding to one of a plurality of different device cards. A top cover includes side walls that is assembled with the base module. A device card of the plurality of different device cards is positioned between the base module and the top cover by at least one of the registration features.