Universal Sub-Slot Module Architecture for Plug-In Network Upgrades
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Solution Overview
Problem
Conventional networking hardware systems require multiple modules for different client types and line types, leading to excess inventory and high costs, and lack the ability to plug and play at a sub-card level, necessitating new modules with each technology upgrade, and include filler modules that add manufacturing and assembly complexity.
Innovation Solution
A universal sub slot architecture with interchangeable modules, including a common form factor and interface definition, allowing cross-platform compatibility and presence detection without connectors or active components, and enabling insertion of new modem technologies without replacing entire modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fixed-size modules are used for different client types and line types, then hardware compatibility is ensured, but inventory requirements increase and cost rises
Solution Approach 1:
The module is divided into a base module and interchangeable sub-modules. The base module provides common functionality, while sub-modules handle specific client types and line types. This segmentation allows a single base module to support multiple functions by simply changing the sub-module, eliminating the need to maintain separate fixed-size modules for each function type.
Solution Approach 2:
The base module is designed with universal interfaces and a standardized sub-module insertion mechanism that allows any supported sub-module to be inserted into the same base module. This multi-functionality enables the system to adapt to different client types and line types without requiring separate dedicated modules, thereby reducing inventory requirements while maintaining hardware compatibility.
2Reliability
If entirely new modules are purchased for each modem technology upgrade, then technology compatibility is ensured, but cost and deployment time increase
Solution Approach 1:
The module architecture separates the modem technology component (sub-module) from the base module. When modem technology upgrades, only the sub-module needs to be replaced, not the entire module. This segmentation enables technology compatibility to be maintained through sub-module updates while minimizing deployment time by avoiding complete module replacements.
Solution Approach 2:
The module design allows dynamic replacement of sub-modules based on technology requirements. The standardized interface and hot-swappable mechanism enable operators to upgrade modem technology by simply removing the old sub-module and inserting a new one, maintaining technology compatibility while reducing deployment time compared to replacing entire modules.
3Measurement precision
If filler modules with connectors and PCBs are used for unequipped slots, then presence detection is enabled, but manufacturing and assembly complexity increases
Solution Approach 1:
The connector and active PCB components are extracted from the filler module, leaving only the essential structural elements (housing and mechanical features). Presence detection is achieved through simplified means such as mechanical keying or basic sensors without requiring full connector assemblies or complex PCB circuits, thereby reducing manufacturing and assembly complexity while maintaining adequate presence detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces costs by allowing flexible use of modules, supports high bandwidths, and enables faster introduction of new technologies, while simplifying assembly and reducing inventory needs.
Implementation Method 1
a Hall Effect Sensor to detect a presence of the filler module based on a magnet thereon
Implementation Method 2
a metal detector to detect a presence of the filler module based on producing an alternating current and detecting a magnetic field produced by the filler module
Data Source
AI summary
A host module configured for insertion into a chassis of a network element includes a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; and a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each. At least one of the one or more universal sub slot modules can be a coherent modem or a router.