Universal Substrate for MicroSAS and MicroSATA Connectors
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Solution Overview
Problem
Current MicroSATA and MicroSAS connectors require different layouts of conductive pads on mounting substrates, necessitating separate designs for each type, which increases costs and complexity, and existing connectors often require pads on both sides of the substrate, complicating manufacturing and assembly.
Innovation Solution
A universal substrate design with conductive pads on one side that can accommodate both MicroSATA and MicroSAS connectors, featuring a specific layout that allows for one-to-one correspondence with each type of connector, along with a plastic cover that provides shielding and improves impedance matching, enabling higher data rates and simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate substrate designs are used for MicroSATA and MicroSAS connectors, then each connector type can have optimized conductive pad layout, but device complexity and manufacturing costs increase
Solution Approach 1:
The substrate is designed with a universal conductive pad layout that can accommodate both MicroSATA and MicroSAS connectors. The pad arrangement is configured to provide one-to-one correspondence with contacts in both connector types, allowing a single substrate design to support multiple connector standards without requiring separate specialized designs for each connector type.
2Adaptability or versatility
If conductive pads are disposed on both sides of the substrate, then connectivity options increase, but manufacturing and assembly complexity increase
Solution Approach 1:
The conductive pads are segmented and disposed exclusively on one side of the substrate rather than distributing pads across both sides. This segmentation approach simplifies the manufacturing process by eliminating the need for complex multi-sided routing and assembly operations, while still providing adequate connectivity for both MicroSATA and MicroSAS connector types through careful pad layout design.
Data Source
AI summary
A substrate comprises a first plurality of conductive pads disposed on a first side of the substrate and a different second plurality of conductive pads disposed on the first side of the substrate. Each conductive pad in the first plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSAS plug connector when the MicroSAS plug connector is mounted onto the substrate. Each conductive pad in the second plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSATA plug connector when the MicroSATA plug connector is mounted onto the substrate. At least one conductive pad belongs to both the first and second pluralities of conductive pads.