Universal Substrate for System in Package Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current System in Package (SIP) devices require unique printed circuit board designs for each system, limiting production efficiency and flexibility, and often necessitate multiple layers in substrates, which can be cumbersome and inefficient.
Innovation Solution
A universal substrate with a matrix of conductive connection pads on its surface allows for flexible system design by enabling different electrical connections to be programmed using bond wires or other methods, reducing the need for multiple layers and enabling the reuse of a single substrate across various SIP systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If unique printed circuit board designs are created for each system, then system customization is achieved, but production efficiency decreases and manufacturing complexity increases
Solution Approach 1:
The patent implements a universal substrate design with a standardized array of conductive pads that can accommodate multiple different system configurations. The substrate includes a grid of pads arranged in rows and columns, allowing various components to be mounted and connected in different patterns to create customized systems without requiring unique substrate designs for each application.
Solution Approach 2:
The invention segments the connection functionality by providing individually addressable conductive pads arranged in a matrix pattern. This segmentation allows selective connection of specific pads to create different circuit configurations, enabling system customization through programming which pads are connected rather than through physical substrate redesign.
2Adaptability or versatility
If multiple layers are used in substrates, then routing flexibility is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions from traditional planar routing within layers to three-dimensional wire bonding between surface-mounted components and conductive pads. This dimensional change allows complex routing paths to be achieved through vertical wire connections rather than requiring multiple substrate layers, simplifying the substrate structure while maintaining routing flexibility.
3Adaptability or versatility
If traditional PCB designs are used for each system, then system-specific requirements are met, but the number of layers increases and assembly complexity grows
Solution Approach 1:
The invention introduces dynamic reconfigurability through programmable connections between conductive pads using wire bonding. The system can be reconfigured for different applications by programming which pads are connected, allowing the same physical substrate to adapt to various system requirements without physical modification or increased assembly complexity.
Data Source
AI summary
A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.