Universal Test Socket for Semiconductor Devices
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Solution Overview
Problem
Existing semiconductor test sockets require frequent replacement and lengthy attachment/detachment processes when testing different semiconductor devices, as they need to match the terminal arrangement of each device and can be inefficient in identifying and addressing individual terminal issues.
Innovation Solution
A universal test socket design featuring a first sub-layer with through conductors at a specific pitch and a second sub-layer with conductors at a smaller pitch, allowing for contact and electrical connection without precise alignment, along with a test control unit for efficient testing and handling of multiple semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a test socket is designed with terminals matching a specific semiconductor device arrangement, then testing accuracy is improved, but adaptability to other device types deteriorates
Solution Approach 1:
The test socket is designed with a universal structure that can accommodate multiple types of semiconductor devices. The socket includes a mounting structure with multiple mounting holes arranged in different patterns, allowing the same socket to be used for testing various device types without replacement, thus achieving multi-functionality and adaptability while maintaining testing accuracy through precise terminal contact.
2Reliability
If test socket terminals are precisely aligned with semiconductor device terminals, then contact reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The test socket structure is segmented into a mounting structure with multiple mounting holes and a terminal structure. The mounting holes are arranged in different patterns to accommodate various device types, while the terminal structure maintains precise contact capability. This segmentation allows independent optimization of each component, achieving contact reliability without excessive manufacturing complexity.
3Measurement precision
If a new test socket is created for each semiconductor device type, then testing precision is improved, but time consumption increases
Solution Approach 1:
The universal test socket eliminates the need to create and replace different test sockets for different semiconductor device types. The mounting structure with multiple mounting hole patterns allows a single socket to accommodate various devices, significantly reducing the time for attaching and detaching test sockets while maintaining testing precision through reliable terminal contact.
4Ease of operation
If test socket structure is simplified for easier replacement, then ease of operation is improved, but contact reliability may deteriorate
Solution Approach 1:
The test socket is divided into a mounting structure with multiple mounting holes and a terminal structure. This segmentation allows the socket to be easily mounted and removed using the simplified mounting hole patterns, while the terminal structure maintains precise contact capability. The modular design achieves both ease of operation and contact reliability.
Data Source
AI summary
A universal test socket including a first sub-layer including a plurality of first through conductors, the plurality of first through conductors arranged at a first pitch in a first substrate, and a second sub-layer including a plurality of second through conductors, the second sub-layer stacked on the first sub-layer so that the plurality of first through conductors are in contact with the plurality of second through conductors, the plurality of second through conductors arranged at a second pitch in a second substrate, the second pitch being less than or equal to the first pitch may be provided.