Universal Thermal Ejection Chip Base for Custom Printhead Configurations
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Solution Overview
Problem
Existing thermal inkjet printhead designs require unique components and longer development cycles due to fixed vertical resolution, making it difficult to achieve customized designs and shorter development times.
Innovation Solution
A common thermal ejection chip architecture is developed, allowing for various printhead configurations by using a base chip design that can be tailored through back-end-of-line processing to accommodate different resolutions, such as 1200 dpi, 600 dpi, and 300 dpi, without the need for custom-tailored components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed vertical resolution is specified in typical ejection chip designs, then the heater addressing matrix and electrical interfaces can be defined, but unique components (ASIC, driver card, carrier) are required for each design which increases development resources and time to market
Solution Approach 1:
The patent implements a universal carrier board design that can accommodate multiple printhead models (600 dpi, 1200 dpi, 2400 dpi) through a standardized electrical interface architecture. The carrier board includes a common ASIC and driver card design that works across different resolutions, eliminating the need for unique components for each printhead model. This is achieved through a standardized connector layout and addressing matrix that can be configured for different resolutions without requiring custom hardware design.
Solution Approach 2:
The patent segments the printhead system into modular components: a standardized carrier board containing the ASIC and driver card, and interchangeable printhead assemblies with different resolutions. This segmentation allows the electrical interface components to be standardized and reused across multiple printhead designs, while only the ejection chip portion needs to be customized for different resolutions.
2Adaptability or versatility
If unique components are designed for each printhead model, then specific design requirements are met, but development time and resources increase
Solution Approach 1:
The patent performs preliminary action by designing and standardizing the carrier board and electrical interface components in advance, creating a reusable platform that can accommodate multiple printhead resolutions. This preliminary standardization work eliminates the need for repeated component design and testing for each new printhead model, significantly reducing development time while maintaining adaptability to different resolution requirements.
Solution Approach 2:
The universal carrier board design serves multiple functions across different printhead models, providing a common electrical interface, addressing matrix, and control architecture that works with 600 dpi, 1200 dpi, and 2400 dpi printheads. This multi-functionality allows a single design to support multiple product variants, reducing development resources and time to market.
3Manufacturing precision
If different resolution printheads use dissimilar electrical interfaces, then each design can be optimized, but cost-effective bill of materials is offset by increased development resources
Solution Approach 1:
The patent creates a universal electrical interface platform that can be used across multiple printhead resolutions (600 dpi, 1200 dpi, 2400 dpi), allowing the same ASIC, driver card, and carrier board design to serve different resolution requirements. This universality reduces development costs by eliminating the need to design and validate separate electrical interfaces for each resolution, while still maintaining the ability to manufacture different resolution products.
Solution Approach 2:
The patent uses parameter changes to achieve different resolutions from a common electrical interface design. By modifying only the ejection chip parameters (heater element spacing, number of nozzles) while keeping the electrical interface parameters standardized, the system can produce multiple resolution variants without changing the fundamental electrical architecture, thereby reducing development costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables shorter development cycles and customized designs to fit individual customer needs, reducing costs and time to market by using a common chip base for multiple thermal ejection chip configurations.
Implementation Method 1
one or more heater elements, such as electrical resistors, are disposed for transferring thermal energy into liquid ink
Implementation Method 2
The liquid ink is heated such that a rapid volumetric change occurs in the ink resulting from a liquid to vapor transition
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
An inkjet printer (40) including a printhead (10) with a fluid ejection chip and an associated method of forming is described. The fluid ejection chip includes a substrate, a plurality of groups of drive elements formed on the substrate, and a plurality of fluid ejection devices disposed on the substrate. Each group of drive elements includes at least two drive elements electrically coupled in parallel. Each fluid ejection device of the plurality of fluid ejection devices is electrically coupled with a respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively activate the plurality of fluid ejection devices for causing fluid to be expelled from the printhead (10) in accordance with image data.