Universal Transceiver Pad Layout for Flexible Network Support
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Solution Overview
Problem
Current electronic devices require significant space and increased manufacturing costs due to the need for separate and dedicated circuit designs and solder pads for different network communication types and frequency bands, making it difficult to modify between WCDMA and TD-SCDMA frequencies.
Innovation Solution
The implementation of a circuit board with a single transceiver module pad that can accommodate both WCDMA and TD-SCDMA transceiver modules, using the same footprint and reducing the number of solder pads, allowing for flexible modification between different network communication types and frequency bands without altering the circuit board layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate and dedicated circuit designs are used for different network communication types and frequency bands, then each communication type can be supported reliably, but the board area and manufacturing cost increase significantly
Solution Approach 1:
The patent implements a universal transceiver module pad layout that can accommodate different transceiver modules for various network communication types (WCDMA, TD-SCDMA, etc.) and frequency bands. The same pad layout is used across different communication standards, allowing the circuit board to support multiple functions without requiring separate dedicated pads for each communication type, thereby reducing board area while maintaining reliable support for each standard.
2Reliability
If separate and dedicated circuit designs are used for different network communication types and frequency bands, then each communication type can be supported reliably, but the manufacturing cost increases
Solution Approach 1:
The universal pad layout enables a single manufacturing process to produce circuit boards that support multiple communication standards. By using the same pad design for different transceiver modules, the manufacturing process is simplified and standardized, reducing production complexity and cost while ensuring reliable support for each communication type through proper module selection and installation.
Solution Approach 2:
The patent utilizes parameter changes in the transceiver modules themselves (rather than in the pad layout) to accommodate different communication standards and frequency bands. This allows the same physical pad structure to work with modules that have different electrical parameters, enabling cost-effective manufacturing while maintaining support for multiple standards.
3Adaptability or versatility
If the circuit board is modified to support different frequency bands, then new communication capabilities are added, but the component layout and routing must be changed
Solution Approach 1:
The universal pad layout design allows the circuit board to adapt to different frequency bands and communication standards without requiring changes to the component layout or routing. The same pad positions and connections are used regardless of which transceiver module is installed, enabling easy adaptation to new standards while maintaining a fixed, simplified board design.
4Adaptability or versatility
If multiple dedicated transceiver module pads are used, then different communication types can be supported, but the pin count and board area increase
Solution Approach 1:
The patent uses a single universal transceiver module pad that can be configured to support different communication types through module selection rather than through separate physical pads. This universal approach reduces the total number of pins and pad connections required on the board while maintaining the ability to support multiple communication standards through the same physical interface.
Data Source
AI summary
Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.