Universal Wire Bond Head for Round and Ribbon Wires
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Solution Overview
Problem
Conventional wire bonding machines require the replacement of bond head modules to accommodate different types of wires, such as round and ribbon wires, due to distinct design requirements, leading to time-consuming adjustments and reduced efficiency.
Innovation Solution
A universal wire clamp design with parallel clamping plates oriented perpendicularly to the transducer axis and adjustable lateral guides allows for interchangeable bonding of round and ribbon wires without changing the bond head, ensuring proper alignment and guiding for both wire types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the bond head module is replaced to accommodate different wire types (round vs ribbon), then the bonding capability for each wire type is optimized, but the device complexity and operation time increase due to frequent module exchanges
Solution Approach 1:
The wire clamp is designed with a universal structure that can accommodate both round wires and ribbon wires through the same bond head module. The clamping plates are arranged parallel to each other and can be positioned to suit different wire types, eliminating the need for separate bond head modules for round and ribbon wires.
Solution Approach 2:
The wire clamp incorporates adjustable components that allow dynamic reconfiguration for different wire types. The clamping plates and lateral guides can be repositioned or adjusted to accommodate the specific requirements of round wires (lateral placement accuracy) or ribbon wires (placement accuracy along transducer axis) without replacing the entire bond head module.
2Manufacturing precision
If the bond head module is exchanged to bond ribbon wire, then the placement accuracy along transducer axis is improved, but the loss of time increases due to module replacement and recalibration
Solution Approach 1:
The wire clamp is pre-configured with adjustable components that can be quickly repositioned for different wire types. The clamping plates are designed to be adjustable parallel to each other, allowing rapid adaptation from round wire to ribbon wire configuration without complete module replacement, thereby reducing conversion time while maintaining placement accuracy.
3Manufacturing precision
If the wire clamp design is optimized for round wire with lateral guides, then lateral placement accuracy is improved, but the adaptability to ribbon wire decreases requiring module replacement
Solution Approach 1:
The wire clamp uses parallel clamping plates that serve dual purposes: they provide lateral guidance for round wires to achieve lateral placement accuracy, and they can be repositioned to clamp onto the wider surface of ribbon wires. This universal design eliminates the need for different wire clamp designs for round and ribbon wires.
Solution Approach 2:
The clamping plates are designed to be adjustable parallel to each other, allowing the wire clamp to dynamically adapt its configuration. For round wires, the plates provide lateral guidance; for ribbon wires, the plates can be repositioned to clamp onto the broader surface, maintaining adaptability while preserving lateral placement accuracy capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient bonding of both round and ribbon wires using a single bond head module, reducing conversion time and improving machine efficiency by eliminating the need for frequent module exchanges.
Implementation Method 1
The transducer generates ultrasonic power and induces ultrasonic vibrations of the wedge to bond the wire to a surface of a substrate using heat and ultrasonic energy.
Data Source
AI summary
A wedge wire bonder comprises a wedge that is operative to oscillate along a transducer axis for bonding a wire onto a surface and a wire clamp comprising a pair of parallel clamping plates for clamping the wire. The clamping plates having clamping surfaces that are oriented substantially perpendicularly to the transducer axis. Lateral guides are arranged on opposite sides of the wire, such that the lateral guides and the wire are generally aligned parallel to the clamping surfaces of the clamping plates for guiding the wire towards the wedge.