Unobstructed Thermal Path for Semiconductor Device Testing
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Solution Overview
Problem
Existing semiconductor device testing methods face inefficiencies in active thermal control, leading to temperature deviations during characterization, which can result in incorrect characterization of integrated circuits.
Innovation Solution
A thermal structure with a coolant block above and a thermal transfer block below the device under test, featuring heating elements in the walls of the thermal transfer block, allows for an unobstructed thermal path, enabling precise control of thermal energy transfer without obstructing the path between the coolant block and the thermal transfer block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating element is placed between the coolant block and the thermal transfer block, then heating capability is improved, but the thermal path for cooling becomes obstructed and cooling efficiency deteriorates
Solution Approach 1:
The heating element is segmented from the main thermal path by placing it in the sidewall rather than in the central cooling path. This segmentation allows the cooling path to remain unobstructed while the heating element can still transfer thermal energy to the thermal transfer block through the sidewall structure.
Solution Approach 2:
The heating element is moved from the vertical dimension (between coolant block and thermal transfer block) to the horizontal dimension (in the sidewall). This dimensional change allows heating functionality to be added without obstructing the vertical cooling path.
2Speed
If the thermal path is made unobstructed for efficient cooling, then cooling speed is improved, but the ability to apply localized heating deteriorates
Solution Approach 1:
The thermal management system is segmented into separate heating and cooling zones. The heating element in the sidewall serves the heating function while the central unobstructed path serves the cooling function, allowing both operations to occur simultaneously without interference.
Solution Approach 2:
The sidewall structure acts as an intermediary medium that allows the heating element to transfer thermal energy to the thermal transfer block without obstructing the main cooling path. The sidewall mediates between the heating element and the thermal transfer block, enabling localized heating while maintaining overall cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures accurate and efficient thermal management, maintaining the operational temperature of the device under test within a narrow tolerance, enhancing the characterization and binning process of semiconductor dies.
Implementation Method 1
a heating element in a wall of the thermal transfer block adds thermal energy to the thermal transfer block
Implementation Method 2
a coolant block above the thermal transfer block removes thermal energy from the thermal transfer block
Data Source
AI summary
Systems, apparatuses, and methods for efficiently performing active thermal control during device testing are disclosed. A device testing system includes a device under test, a thermal structure on top of the device under test, and a controller configured to determine when to apply and remove thermal energy to the device under test through the thermal structure. The thermal structure includes a thermal transfer block that transfers thermal energy to and from the device under test below the thermal transfer block. The thermal structure also includes a coolant block above the thermal transfer block that removes thermal energy from the thermal transfer block. There is no heating element between the coolant block and the thermal transfer block. Rather, the thermal structure includes a heating element in a wall of the thermal transfer block. Therefore, an unobstructed thermal path exists from the device under test to the coolant block.