Unpacked RF Power Device Embedded in PCB
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Solution Overview
Problem
Conventional radio frequency power amplifier modules with packaged power devices limit design flexibility, miniaturization, and performance due to parasitic capacitance, inductance, and errors in pin welding, restricting user customization and device performance.
Innovation Solution
A power device without a package structure in a radio frequency power amplifier module, where the power device is embedded into a printed circuit board, connected via bond-wires, and protected by a shielding frame and sealant, eliminating the need for ceramic packages and input/output pins, allowing direct connections and improved design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a packaged power device with ceramic package is used, then the device is protected and easy to manufacture, but design flexibility is limited and parasitic capacitance is introduced
Solution Approach 1:
The patent extracts and removes the ceramic package structure from the power device, exposing the semiconductor die and bond-wires directly. This eliminates the parasitic capacitance introduced by the package while maintaining device protection through alternative means such as PCB embedding and shielding structures. The extraction principle directly resolves the contradiction by removing the protective package that was limiting design flexibility.
Solution Approach 2:
The patent merges the power device directly with the PCB by embedding the semiconductor die into the PCB substrate and making direct electrical connections through bond-wires to PCB traces. This integration eliminates the separate package structure and input/output pins, allowing the power device to become part of the PCB assembly itself, thereby improving design flexibility while maintaining reliability through the integrated structure.
2Ease of manufacture
If input and output pins are used for connection, then the device is easy to assemble, but device width cannot be reduced and inductance is introduced
Solution Approach 1:
The patent merges the input/output connection function directly into the PCB traces, eliminating separate input and output pins. The bond-wires connect the semiconductor die directly to PCB trace patterns, integrating the connection function into the PCB structure itself. This reduces device width by eliminating protruding pins while maintaining assembly ease through direct welding of bond-wires to PCB traces.
Solution Approach 2:
The patent extracts and removes the traditional input and output pins from the device structure. Instead of using separate pins that protrude from the device, the connections are made directly through bond-wires to PCB traces, eliminating the need for pin structures and reducing overall device width while maintaining electrical connection functionality.
3Reliability
If welding of input and output pins to PCB is performed, then electrical connection is achieved, but large errors and inductance are introduced affecting matching circuit
Solution Approach 1:
The patent extracts and removes the traditional input/output pin welding process. Instead of welding pins to PCB, the semiconductor die is embedded directly into the PCB substrate and bond-wires are used to create electrical connections directly between the die and PCB trace patterns. This eliminates the pin welding step and its associated errors and inductance, improving manufacturing precision.
Solution Approach 2:
The patent merges the electrical connection function directly into the PCB trace structure by embedding the semiconductor die into the PCB and using bond-wires to connect directly to trace patterns. This integration eliminates the separate pin welding process, reducing welding errors and inductance while maintaining reliable electrical connection between the power device and PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances design flexibility, reduces inductance, improves performance, and allows for customized designs, while preventing external contamination and damage, thus addressing the limitations of conventional packaged devices.
Implementation Method 1
The electronic elements are connected with each other through the bond-wires, and the electronic elements are directly connected to the printed circuit board through the bond-wires
Implementation Method 2
a heat dissipating plate disposed below the power device and the printed circuit board
Implementation Method 3
The power device and the printed circuit board are fixedly welded on the heat dissipating plate
Data Source
AI summary
An unpacked structure for a power device of radio frequency power amplification module and assembly method therefor. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board, wherein the power device is embedded into the printed circuit board; the heat dissipating plate is arranged below the power device and the printed circuit board; the power device includes a carrier flange, a plurality of electronic elements and a plurality of lead wires; the electronic elements are directly welded on the carrier flange according to a design requirement; the power device and the printed circuit board are welded and fixed on the heat dissipating plate; and the electronic elements on the power device are connected with one another through the lead wires and directly connected with the printed circuit board through the lead wires.