Unsawed Package-on-Package Jig Handling for High Throughput
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Solution Overview
Problem
The miniaturization of integrated circuits leads to smaller package units and jigs, making handling difficult and resulting in low throughput and yield due to the complexity in bonding upper component stacks to units during the packaging and testing process.
Innovation Solution
A method where a plurality of unsawed bottom units, each comprising a package substrate and a die, are placed on a jig, and upper component stacks are bonded with solder balls to the units, followed by a reflow process to form integrated packages, allowing for easier handling and increased throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of integrated circuits is reduced for miniaturization, then the circuit density and integration level are improved, but the handling difficulty increases and throughput decreases
Solution Approach 1:
Multiple small units are combined and handled together on a single larger jig during the bonding process. The jig accommodates multiple units simultaneously, allowing parallel processing and eliminating the need to handle each tiny unit individually, thus maintaining high throughput despite miniaturization.
Solution Approach 2:
A larger jig serves as an intermediary carrier that holds multiple small units. This intermediary device enables easy handling of miniaturized components by providing a stable, manageable platform that accommodates multiple units during the bonding process.
2Manufacturing precision
If the size of jigs is reduced to match smaller units, then the packaging precision is improved, but the handling difficulty increases
Solution Approach 1:
Multiple precision-critical bonding operations are merged into a single process step by accommodating multiple units on one jig. This eliminates the need for repeated jig handling and repositioning, maintaining packaging precision while significantly improving ease of operation.
Solution Approach 2:
The overall packaging process is segmented into discrete steps where units are prepared and positioned on the jig before the bonding operation. This segmentation allows for precise positioning of multiple units simultaneously without requiring repeated handling of individual tiny jigs.
3Manufacturing precision
If multiple units are processed individually on separate jigs, then the bonding precision is improved, but the throughput decreases
Solution Approach 1:
Multiple bonding operations that would normally be performed on separate jigs are merged into a single process step. The larger jig accommodates multiple units simultaneously, allowing all bonding operations to be performed in parallel, thus maintaining precision while dramatically increasing throughput.
Solution Approach 2:
The processing approach transitions from sequential handling of individual units to parallel processing of multiple units on a single jig. This dimensional change in the processing architecture enables simultaneous bonding operations without compromising precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the handling of small jigs and units, enhancing the packaging process efficiency and yield by accommodating multiple units on a larger jig, thereby improving the overall throughput and reducing the likelihood of errors during bonding.
Implementation Method 1
A reflow is performed to melt the solder bumps that interconnect the dies and the laminate substrate
Data Source
AI summary
A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.