Upper Brush Fitting Structure for Low-Particle Wafer Cleaning
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Solution Overview
Problem
The existing wafer cleaning systems face challenges with particle generation due to the shifting of steel pipes during interference fitting, which can damage integrated circuits on the wafer substrate.
Innovation Solution
The proposed solution involves a fitting comprising a base plate, a flanged pipe, and a threaded connector, where the flanged pipe is inserted into the base plate such that the flange rests on a stop surface, and the hollow tube passes through a channel, preventing the pipe from shifting and contacting the upper brush.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If interference fitting is used to connect steel pipes, then assembly simplicity is improved, but pipe stability deteriorates causing shifting and particle generation
Solution Approach 1:
The fitting is divided into multiple components: a base plate with a hole, a steel pipe, and a retaining mechanism. This segmentation allows the pipe to be securely held through a structured assembly process that prevents shifting while maintaining ease of installation.
Solution Approach 2:
The base plate is prepared in advance with a precisely positioned hole and retaining features before the pipe installation. This preliminary preparation ensures that when the pipe is inserted, it is immediately secured in the correct position, preventing any shifting during operation.
2Object-generated harmful factors
If pipe securing mechanisms are added to prevent shifting, then particle generation is reduced, but device complexity increases
Solution Approach 1:
The retaining mechanism is merged with the base plate structure itself, integrating the securing function into the existing fitting components rather than adding separate, complex mechanisms. This reduces overall device complexity while effectively preventing pipe shifting and particle generation.
Data Source
AI summary
A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.