Upper Brush Fitting Structure to Minimize Wafer Cleaning Particles

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Solution Overview

Problem

Existing wafer cleaning systems face challenges with particle generation due to the shifting of steel pipes during interference fitting, which can damage integrated circuits on the wafer substrate.

Innovation Solution

A fitting comprising a base plate, a flanged pipe, and a threaded connector is used to securely attach the flanged pipe to the base plate, preventing it from shifting and contacting the upper brush, thus reducing particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If interference fitting is used to attach steel pipes, then assembly simplicity is improved, but particle generation increases due to pipe shifting

Engineering Contradiction:
Improveassembly simplicityVSAvoidparticle generation
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The fitting is divided into multiple components: a base plate with channel, a flanged pipe with flange, and a threaded connector. This segmentation allows each component to perform its specific function - the base plate provides structural support, the flanged pipe provides fluid passage with a secure connection interface, and the threaded connector provides adjustable attachment. This resolves the contradiction by enabling secure attachment (reducing particle generation) while maintaining ease of assembly through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flanged pipe acts as an intermediary component between the base plate and the threaded connector. The flange on the flanged pipe provides a secure attachment surface that prevents shifting, while the threaded connector allows for adjustable positioning. This intermediary structure eliminates the particle generation problem of direct interference fitting while maintaining assembly simplicity through standardized connection interfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If interference fitting is used for steel pipes, then device complexity is reduced, but reliability deteriorates due to pipe shifting and contact with upper brush

Engineering Contradiction:
Improvestructure simplicityVSAvoidpipe positioning stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The fitting design incorporates adjustability through the threaded connector, which can be rotated to achieve the desired position and secure the flanged pipe firmly to the base plate. This dynamic adjustment capability ensures reliable positioning while maintaining a relatively simple structure. The design adapts to different installation requirements without compromising stability, resolving the contradiction between simplicity and reliability.

Inventive Principle:
Principle #15Dynamics

3Object-generated harmful factors

If flanged pipe with threaded connector is used, then particle generation is reduced, but device complexity increases

Engineering Contradiction:
Improveparticle generationVSAvoidstructure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The fitting applies different connection methods at different locations: the flanged pipe provides a secure, fixed connection at the base plate attachment point to prevent shifting and particle generation, while the threaded connector provides adjustable positioning capability. This localized application of different connection qualities resolves the contradiction by ensuring stability where needed while maintaining overall structural simplicity through standardized components.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12237179B2Fittings for wafer cleaning systems
Publication Date: 2025.02.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12237179B2 patent drawing
  • US12237179B2 patent drawing
  • US12237179B2 patent drawing

AI summary

A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.