Upper Electrode Segmentation for RF Noise Suppression
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Solution Overview
Problem
Noise generated by radio frequency power in capacitively coupled plasma processing apparatuses can cause malfunctions and is not effectively suppressed by existing technologies.
Innovation Solution
The upper electrode is designed with a central electrode, peripheral electrodes, laminated dielectric bodies, and power supply electrodes, which attenuate RF noise and ensure uniform RF power propagation, while also controlling plasma density and preventing abnormal discharges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If radio frequency power is applied to generate plasma in capacitively coupled plasma processing apparatus, then plasma generation is achieved, but noise is generated causing malfunctions
Solution Approach 1:
The upper electrode is divided into multiple independent electrodes (central electrode and peripheral electrodes) that can be independently controlled. This segmentation allows different regions to handle different functions, with the peripheral electrodes specifically designed to suppress noise while the central electrode generates plasma, thus resolving the contradiction between plasma generation and noise suppression
Solution Approach 2:
Dielectric layers are introduced as intermediary elements between the electrodes and the processing chamber. These dielectric layers act as mediators that allow RF power to be applied for plasma generation while simultaneously filtering and suppressing the noise generated, thus resolving the contradiction between achieving plasma and preventing noise-induced malfunctions
2Power
If RF power is applied to the upper electrode, then plasma is generated, but noise propagation occurs causing system malfunctions
Solution Approach 1:
By segmenting the upper electrode into multiple independently controllable electrodes, the system can apply RF power for plasma generation in the central region while simultaneously using peripheral electrodes to suppress noise propagation, thereby maintaining system reliability without sacrificing plasma generation capability
Solution Approach 2:
The invention changes the electrical parameters by introducing multiple dielectric layers with different properties between the electrodes and the chamber. These dielectric layers modify the RF field distribution and impedance characteristics, enabling plasma generation while suppressing noise propagation and improving system reliability
3Manufacturing precision
If uniform RF power distribution is desired across the substrate, then proper electrode configuration is needed, but noise suppression must also be achieved
Solution Approach 1:
The upper electrode is segmented into central and peripheral regions with independent control. This segmentation enables the central electrode to provide uniform RF power distribution for consistent plasma density across the substrate, while the peripheral electrodes simultaneously suppress noise, thus achieving both manufacturing precision and noise control
Solution Approach 2:
Different regions of the upper electrode are assigned different functions: the central region is optimized for uniform power distribution to ensure consistent plasma density, while the peripheral regions are optimized for noise suppression. This local differentiation of quality and function allows simultaneous achievement of uniform plasma density and noise suppression
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses noise, ensures uniform plasma density distribution, and prevents abnormal discharges, enhancing the reliability and performance of plasma processing.
Implementation Method 1
multiple dielectric bodies (52 to 54) are laminated between the counter surface (3a) and a surface (3b) of the upper electrode opposite to the counter surface (3a)
Data Source
AI summary
An upper electrode includes a central electrode, a peripheral electrode, multiple dielectric bodies, and multiple power supply electrodes. The central electrode is disposed on a counter surface of the upper electrode facing a substrate support, on which a target object that is a plasma processing target is placed, at a position corresponding to a central portion of the substrate support. The peripheral electrode is disposed on the counter surface to encircle a periphery of the central electrode. The dielectric bodies are laminated between the counter surface and a surface of the upper electrode opposite to the counter surface. The power supply electrode is arranged between the dielectric bodies to electrically connect the central electrode and the peripheral electrode respectively to power supply terminals individually disposed at the surface opposite to the counter surface.