Non-Photosensitive Upper Layer Film for Semiconductor Immersion Exposure
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Solution Overview
Problem
In semiconductor manufacturing, the liquid immersion exposure method for forming patterns on workpieces often results in defects due to direct contact between photosensitive resist films and immersion liquids, leading to film deterioration and contamination issues.
Innovation Solution
A method for producing a non-photosensitive upper layer film using a composition that involves cleaning a production device with a solvent until the resin concentration reaches 10 ppm or less, utilizing a production device with specific components like a preparation tank, pump, filtration machine, and valve, and using solvents with matching solubility parameters to minimize resin residue and prevent defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photosensitive resist film is directly exposed using the liquid immersion exposure method, then high resolution can be obtained, but the photosensitive resist film may be deteriorated and contaminated by the immersion liquid
Solution Approach 1:
A non-photosensitive upper layer film is introduced as an intermediary between the photosensitive resist film and the immersion liquid. This intermediate film allows the immersion liquid to contact only the upper layer rather than the photosensitive resist, preventing direct contamination while maintaining the liquid immersion exposure method's high resolution capability
Solution Approach 2:
The resist structure is segmented into multiple layers: a photosensitive resist film at the bottom and a non-photosensitive upper layer film on top. This segmentation separates the function of light reception (photosensitive layer) from the function of immersion liquid contact (upper layer), allowing both high resolution and contamination prevention
2Manufacturing precision
If the production device is cleaned thoroughly to reduce resin concentration to 10 ppm or less, then pattern defects are suppressed, but the cleaning process time and complexity increase
Solution Approach 1:
The cleaning process uses parameter changes by selecting cleaning liquids with specific solubility parameters that match the resin components. By choosing cleaning liquids whose solubility parameters differ from the composition solvents (|SPW - SPB| < 1.0 MPa^1/2), the cleaning process efficiently removes resin to 10 ppm or less while optimizing cleaning time
Solution Approach 2:
The cleaning process incorporates feedback control by measuring the resin concentration in the cleaning liquid and continuing cleaning until the concentration reaches 10 ppm or less. This feedback mechanism ensures defect suppression while avoiding excessive cleaning that would waste time
3Object-affected harmful factors
If a non-photosensitive upper layer film is provided between the photosensitive resist film and immersion liquid, then film contamination is prevented, but the process complexity and number of steps increase
Solution Approach 1:
The non-photosensitive upper layer film serves multiple functions simultaneously: it acts as a barrier preventing immersion liquid contamination, provides a surface for liquid immersion exposure, and can be removed afterward to reveal the pattern. This multi-functionality justifies the additional process step by eliminating contamination issues
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces pattern defects by ensuring a clean production environment and appropriate solvent selection, resulting in high-quality, defect-free patterns with improved film thickness and transparency.
Implementation Method 1
cleaning a production device for a composition XA for forming a non-photosensitive upper layer film with a cleaning liquid to clean the production device until a concentration of a resin included in the cleaning liquid reaches 10 ppm by mass or less
Data Source
AI summary
A method for producing a composition for forming a non-photosensitive upper layer film that is disposed on a workpiece and a photosensitive resist film, the production method includes cleaning a production device for a composition XA for forming a non-photosensitive upper layer film with a cleaning liquid to clean the production device until a concentration of a resin included in the cleaning liquid reaches 10 ppm by mass or less, discharging the cleaning liquid from the production device, and producing the composition XA for forming a non-photosensitive upper layer film using the production device. The cleaning, the discharging, and the producing are performed in this order.